Printed wiring board and its manufacturing method
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
1. An electroless plating solution which comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion, 0.05 to 0.3 mol/L of tartaric acid or a salt thereof and nickel ion formed from at least one of nickel chloride and nickel sulfate,
wherein
said reducing agent comprises at least one selected from the group consisting of formaldehyde and hydrazine.
2. An electroless plating solution which comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and 0.01 to 0.05 weight % of at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion,
wherein
said reducing agent comprises at least one selected from the group consisting of formaldehyde and hydrazine, and
said nickel ion is formed from at least one of nickel chloride and nickel sulfate.
3. The electroless plating solution according to claim 1 or 2 wherein said electroless plating solution has a specific gravity of 1.02 to 1.10.
4. The electroless plating solution according to claim 1 , the temperature of which is 25 to 40° C.
5. The electroless plating solution according to claim 1 wherein the copper deposition rate of said electroless plating solution is 1 to 2 μm/hour.
6. An electroless plating process which comprises immersing a substrate in the electroless plating solution according to claim 1 and performing electroless copper plating at a deposition rate set to 1 to 2 μm/hour.
7. The electroless plating process according to claim 6 wherein said substrate has a roughened surface.
8. The electroless plating solution according to claim 2 , the temperature of which is 25 to 40° C.
9. The electroless plating solution according to claim 3 , the temperature of which is 25 to 40° C.
10. The electroless plating solution according to claim 2 wherein the copper deposition rate of said electroless plating solution is 1 to 2 μm/hour.
11. The electroless plating solution according to claim 3 wherein the copper deposition rate of said electroless plating solution is 1 to 2 μm/hour.
12. The electroless plating solution according to claim 4 wherein the copper deposition rate of said electroless plating solution is 1 to 2 μm/hour.
13. An electroless plating process which comprises immersing a substrate in the electroless plating solution according to claim 2 and performing electroless copper plating at a deposition rate set to 1 to 2 μm/hour.
14. An electroless plating process which comprises immersing a substrate in the electroless plating solution according to claim 3 and performing electroless copper plating at a deposition rate set to 1 to 2 μm/hour.
15. An electroless plating process which comprises immersing a substrate in the electroless plating solution according to claim 4 and performing electroless copper plating at a deposition rate set to 1 to 2 μm/hour.
16. The electroless plating process according to claim 13 wherein said substrate has a roughened surface.
17. The electroless plating process according to claim 14 wherein said substrate has a roughened surface.
18. The electroless plating process according to claim 15 wherein said substrate has a roughened surface.