Compact balun transformers
Balun transformers are described wherein multiple transformer loops are implemented in a stacked design with the primary and secondary loops overlying one another. By aligning the loops in a vertical direction, instead of offsetting the loops, the area of the device is reduced. Multiple transformer loops are nested on each level, and the transformer loops on a given level are connected together using a crossover located on a different level.
1. An integrated passive device comprising a balun device having a multi-level structure of at least two levels, level one and level two, where the multi-level structure is situated in an essentially horizontal plane and comprises:
(a) an insulating substrate with a resistivity greater than 200 ohm cm
(b) a level one conductive runner formed on the substrate and having a loop pattern,
(c) an interlevel dielectric layer covering the first conductive runner,
(d) a level two conductive runner formed on the interlevel dielectric and having a loop pattern corresponding to the loop pattern of the first conductive runner,
wherein the loop patterns of the level one and level two conductive runners are essentially in vertical alignment.
2. A balun device having a multi-level structure of at least two levels, level one and level two, where the multi-level structure is situated in an essentially horizontal plane and comprises:
(a) an insulating substrate;
(b) a level one conductive runner formed on the substrate and having a loop pattern,
(c) an interlevel dielectric layer covering the first conductive runner the interlevel dielectric having a thickness of at least 2 microns,
(d) a level two conductive runner formed on the interlevel dielectric and having a loop pattern corresponding to the loop pattern of the first conductive runner,
wherein the loop patterns of the level one and level two conductive runners are essentially in vertical alignment.
3. The balun device of claim 2 wherein the loop patterns of the first and second conductive runners comprise at least two loops, with one loop nested inside another loop.
4. The balun device of claim 3 wherein the loops are circular loops, a larger loop and a smaller loop, and the loops have a common center.
5. The balun device of claim 3 wherein the loops are square with rounded corners.
6. The balun device of claim 3 wherein the loops have a spiral configuration.
7. The balun device of claim 3 wherein the loops on the first level are connected with a crossover connection on the second level.
8. The balun device of claim 7 wherein the loops on the second level are connected with a crossover connection on a third level.
9. The balun device of claim 2 wherein the level one and level two loops each have an input end and an output end, wherein the output end of the first loop is connected to the input end of the second loop.
10. An integrated passive device comprising a balun with a multi-level structure of at least three levels, level one, level two, and level three, where the multi-level structure is situated in an essentially horizontal plane and comprises:
(a) an insulating substrate;
(b) a level one conductive runner formed on the substrate the level one conductive runner having a loop pattern comprising at least two loops,
(c) a first interlevel dielectric layer covering the level one conductive runner,
(d) a level two conductive runner formed on the first interlevel dielectric layer the level two conductive runner having a loop pattern corresponding to the loop pattern of the level one conductive runner,
(e) a level two crossover connection formed on the first interlevel dielectric layer connecting two loops of the level one conductive runner,
(f) a second interlevel dielectric layer covering the level two conductive runner,
(g) a level three crossover connection formed on the second interlevel dielectric layer connecting two loops of the level two conductive runner.
11. The integrated passive device of claim 10 wherein the loop patterns of the level one and level two conductive runners are essentially in vertical alignment.
12. A balun device comprising:
a first metal level comprising a primary loop conductor, the primary loop conductor having at least two loops, an inner loop and an outer loop, wherein each loop comprises two segments and the inner and outer loops comprise four segments, a first outer segment, a second outer segment, a first inner segment, and a second inner segment, and wherein each of the four segments is nominally semi-circular, and each has an input end and an output end, the four segments arranged as follows:
the first outer loop segment with the input being the input of the balun secondary,
the first inner loop segment with the input connected to the out put of the first outer loop segment,
the second inner loop segment with the input connected to the output of the first inner loop segment,
the second outer loop segment with the input connected to the output of the second inner loop segment and the output being the output of the balun secondary,
a second metal level comprising a secondary loop conductor having two loops, an inner loop and an outer loop, wherein each loop comprises two segments and the inner and outer loops comprise four segments, a first outer segment, a second outer segment, a first inner segment, and a second inner segment, and wherein each of the four segments is nominally semi-circular, and each has an input end and an output end, the four segments arranged as follows:
the first outer loop segment with the input being the input of the balun primary,
the first inner loop segment with the input connected to the output of the first outer loop segment,
the second inner loop segment with the input connected to the output of the first inner loop segment,
the second outer loop segment with the input connected to the output of the second inner loop segment and the output being the output of the balun secondary,
wherein an inner loop segment and an outer loop segment of the primary conductor are connected with a crossover interconnection and said crossover interconnection is formed on said second level metal.
13. The balun device of claim 12 additionally including a via connected to the output of the second inner loop segment, and a via connected to the input of the second outer loop segment.
14. The balun device of claim 12 additionally including a via connected to the output of the first outer loop segment, and a via connected to the input of the second inner loop segment.
15. The balun device of claim 13 additionally including a crossover connecting the said vias.
16. The balun device of claim 14 additionally including a crossover connecting the said vias.
17. The balun device of claim 12 additionally including a conductive output runner connected to the connection between the first and second inner loop segments.