Array ultrasonic transducer having piezoelectric devices
View Patent ↗An ultrasonic transducer in which lead wire connection is facilitated even when piezoelectric devices are divided in order to prevent lateral vibrations from affecting longitudinal vibrations is manufactured by a method comprising: a step in which first dicing grooves are formed on an acoustic matching layer and a piezoelectric device plate that are mounted together in order to form a plurality of piezoelectric devices; a step in which a board and the respective piezoelectric devices are connected together; a step in which surfaces in the vicinity of locations at which the board and the piezoelectric devices are connected together are coated with a conductive sheet; and a step in which the plurality of transducer elements are formed by forming second dicing grooves between the first dicing grooves formed on the piezoelectric devices and the board that is coated with the conductive sheet and on the acoustic matching layer.
1. An array ultrasonic transducer comprising transducer elements each including a plurality of transducer sub elements, wherein:
the transducer elements include a conductive sheet for electrically connecting:
piezoelectric devices divided into a plurality of pieces by forming first dicing grooves on an acoustic matching layer and a piezoelectric device plate that are mounted together;
a board connected to the piezoelectric devices in such a manner that the board is adjacent to the divided piezoelectric devices; and
electrodes formed on main surfaces of the piezoelectric devices and electrode patterns formed on main surfaces of the board, by coating surfaces in the vicinity of locations at which the board and the piezoelectric devices are connected together with a conductive sheet, and wherein:
the piezoelectric device is divided in such a manner that the piezoelectric devices respectively correspond to the transducer sub elements, and the board is divided in such a manner that the board respectively correspond to the transducer elements, by forming second dicing grooves between two adjacent first dicing grooves formed on the piezoelectric devices and the board being coated with the conductive sheet and on the acoustic matching layer.