Ultrasonic transducer and manufacturing method thereof
A technique capable of obtaining an ultrasonic transducer at high sensitivity in which a plurality of ultrasonic oscillators M 1 each comprising a lower electrode fixed above a substrate, a diaphragm opposed to the substrate with a cavity being put therebetween, and an upper electrode disposed to the diaphragm are arranged above one identical substrate to constitute an ultrasonic transducer and a concentric convex corrugated region having a center identical with the center for the diaphragm is disposed to the diaphragm in an outer side of the cavity exceeding 70% for the radius thereof.
1. An ultrasonic transducer having a plurality of ultrasonic oscillators arranged on one identical substrate,
wherein the ultrasonic transducer includes a lower electrode fixed to the substrate, a diaphragm opposed to the substrate with a cavity being put therebetween, and an upper electrode disposed to the diaphragm, and
wherein the diaphragm has a corrugated structure in an outer region of the cavity exceeding 70% for the radius or one-half width thereof.
2. The ultrasonic transducer according to claim 1 ,
wherein the corrugated structure has a concentric convex shape having a center identical with the center for the diaphragm or a convex shape similar with the profile of the diaphragm.
3. The ultrasonic transducer according to claim 2 ,
wherein a cavity gap at the central portion of the diaphragm and a cavity gap in a region of the diaphragm having the corrugated structure where the upper electrode and the lower electrode are closest with each other are substantially identical when a voltage is not applied between the upper electrode and the lower electrode.
4. The ultrasonic transducer according to claim 2 ,
wherein the cavity gap at the central portion of the diaphragm when a voltage is not applied between the upper electrode and the lower electrode is from 50 to 100 nm.
5. The ultrasonic transducer according to claim 2 ,
wherein a dielectric film is formed between the lower electrode and the cavity and between the upper electrode and the cavity, respectively.
6. The ultrasonic transducer according to claim 2 ,
wherein the diaphragm further has a dimple to the inside of the region having the corrugated structure.
7. The ultrasonic transducer according to claim 6 ,
wherein the dimple is in a doughnuts structure having a center identical with the center for the diaphragm.
8. The ultrasonic transducer according to claim 1 ,
wherein the corrugated structure has a concentric concave shape having center identical with the center for the diaphragm or a concave shape similar with the profile of the diaphragm.
9. The ultrasonic transducer according to claim 8 ,
wherein a cavity gap at the central portion of the diaphragm and a cavity gap in a region of the diaphragm having the corrugated structure where the upper electrode and the lower electrode are furthest from each other are substantially identical when a voltage is not applied between the upper electrode and the lower electrode.
10. The ultrasonic transducer according to claim 8 ,
wherein the cavity gap at the central portion of the diaphragm when a voltage is not applied between the upper electrode and the lower electrode is from 50 to 100 nm.
11. The ultrasonic transducer according to claim 8 ,
wherein a dielectric film is formed between the lower electrode and the cavity and between the upper electrode and the cavity, respectively.
12. The ultrasonic transducer according to claim 1 ,
wherein a multiplexer is formed above the substrate in which an oscillator array comprises a plurality of ultrasonic oscillators or an oscillator array comprises an assembly of a plurality of ultrasonic transducers.