IP Library Granted Patent US 7,702,983
Granted Patent B2
US 7,702,983 · App. 11/744,631 · Granted Apr 20, 2010

Scan compression architecture for a design for testability compiler used in system-on-chip software design tools

Assignee: STMicroelectronics S.R.L.
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Quick Facts
Patent No.
US 7,702,983
App. No.
11/744,631
Granted
Apr 20, 2010
Kind
B2
Abstract

A scan compression architecture for a design for a testability compiler used in system-on-chip software design tools includes a first scan architecture including a first scan compressor/decompressor configuration connected to a first predetermined set of pins, and a second scan architecture including a second scan compressor/decompressor configuration connected to a subset of the pins. The first scan architecture is selectively enabled for executing a scan test with a low time. The second scan architecture is for executing a scan test with high parallelism.

Claims (48)

1. A scan compression architecture for a design for a test compiler used in a system-on-chip software design tool comprising:

a plurality of pins;

a first scan configuration architecture comprising a first scan compressor/decompressor configuration connected to said plurality of pins; and

a second scan architecture comprising a second scan compressor/decompressor configuration connected to a subset of said plurality of pins;

said first scan architecture being enabled for executing a first scan test with a lower test time as compared to executing the first scan test with said second scan architecture, and said second scan architecture being enabled for executing a second scan test with a higher parallelism as compared to executing the second scan test with said first scan architecture.

2. A scan compression architecture according to claim 1 wherein said first scan architecture and said second scan architecture are selectively enabled by an external control signal.

3. A scan compression architecture according to claim 2 wherein said plurality of pins comprises an input pin; and wherein the external control signal is received on the input pin.

4. A scan compression architecture according to claim 1 wherein each of said first and second scan compressor/decompressor configurations is enabled or bypassed for providing two corresponding operating modes.

5. A scan compression architecture according to claim 1 wherein said plurality of pins comprises a plurality of input and output pins; and further comprising a single logic core connected to said plurality of input and output pins; and wherein said first scan compressor/decompressor configuration comprising a first plurality of scan chains, and said second scan compressor/decompressor configuration comprising a second plurality of scan chains.

6. A scan compression architecture according to claim 5 further comprising:

a multiplexer coupled between said plurality of output pins and said single logic core; and

a demultiplexer coupled between said single logic core and said plurality of input;

said multiplexer and said demultiplexer being configured based on a control signal for mapping said first and second plurality of scan chains for said first and second scan compressor/decompressor configurations.

7. A scan compression architecture according to claim 6 wherein operating modes of said first and second scan compressor/decompressor configurations are based on an additional control signal.

8. A scan compression architecture according to claim 7 wherein the operating modes include a first operating mode for selecting scan test patterns associated with said first scan compressor/decompressor configuration, and a second operating mode for selecting scan test patterns associated with said second scan compressor/decompressor configuration, said first scan compressor/decompressor configuration being connected to all of said plurality of input and output pins, and said second scan compressor/decompressor configuration being connected to a portion of said plurality of input and output pans.

9. A scan compression architecture according to claim 8 wherein the control signal and the additional control signal are generated internally based on a JTAG IEEE 1149.1 standard architecture.

10. A scan compression architecture according to claim 8 wherein said plurality of input pins are shared between the first and second operating modes.

11. A scan compression architecture according to claim 8 the first operating mode corresponds to a package level test and the second operating mode corresponds to an electrical wafer level test.

12. A scan compression architecture according to claim 1 further comprising at least one additional scan compressor/decompressor configuration connected to a second subset of said plurality of pins, said at least one additional scan compressor/decompressor configuration being enabled for executing a scan test with predetermined parallelism.

13. A test complier comprising:

a plurality of pins;

a first scan compressor/decompressor configuration connected to said plurality of pins; and

a second scan compressor/decompressor configuration connected to a subset of said plurality of pins;

said first scan compressor/decompressor configuration being enabled for executing a first scan test with a lower test time as compared to executing the first scan test with said second scan compressor/decompressor configuration, and said second scan compressor/decompressor configuration being enabled for executing a second scan test with a higher parallelism as compared to executing the second scan test with said first scan compressor/decompressor configuration.

14. A test complier according to claim 13 wherein said first scan compressor/decompressor configuration and said second scan compressor/decompressor configuration are selectively enabled by an external control signal.

15. A test complier according to claim 14 wherein said plurality of pins comprises an input pin; and wherein the external control signal is received on the input pin.

16. A test complier according to claim 13 wherein each of said first and second scan compressor/decompressor configurations is enabled or bypassed for providing two corresponding operating modes.

17. A test complier according to claim 13 wherein said plurality of pins comprises a plurality of input and output pins; and further comprising a single logic core connected to said plurality of input and output pins; and wherein said first scan compressor/decompressor configuration comprising a first plurality of scan chains, and said second scan compressor/decompressor configuration comprising a second plurality of scan chains.

18. A test complier according to claim 17 further comprising:

a multiplexer coupled between said plurality of output pins and said single logic core; and

a demultiplexer coupled between said single logic core and said plurality of input;

said multiplexer and said demultiplexer being configured based on a control signal for mapping said first and second plurality of scan chains for said first and second scan compressor/decompressor configurations.

19. A test complier according to claim 18 wherein operating modes of said first and second scan compressor/decompressor configurations are based on an additional control signal.

20. A test complier according to claim 19 wherein the operating modes include a first operating mode for selecting scan test patterns associated with said first scan compressor/decompressor configuration, and a second operating mode for selecting scan test patterns associated with said second scan compressor/decompressor configuration, said first scan compressor/decompressor configuration being connected to all of said plurality of input and output pins, and said second scan compressor/decompressor configuration being connected to a portion of said plurality of input and output pins.

21. A test complier according to claim 20 wherein the control signal and the additional control signal are generated internally based on a JTAG IEEE 1149.1 standard architecture.

22. A test complier according to claim 20 wherein said plurality of input pins are shared between the first and second operating modes; and wherein the first operating mode corresponds to a package level test and the second operating mode corresponds to an electrical wafer level test.

23. A method for providing a scan compression architecture through a design for testability compiler used in a system-on-chip, the method comprising:

connecting a first scan compressor/decompressor configuration to a plurality of pins; and

connecting a second scan compressor/decompressor configuration to a subset of the plurality of pins;

the first scan compressor/decompressor configuration being enabled for executing a first scan test with a lower test time as compared to executing the first scan test with the second scan compressor/decompressor configuration, and the second scan compressor/decompressor configuration being enabled for executing a second scan test with a higher parallelism as compared to executing the second scan test with the first scan compressor/decompressor configuration.

24. A method according to claim 23 wherein the first scan compressor/decompressor configuration and the second scan compressor/decompressor configuration are selectively enabled by an external control signal.

25. A method according to claim 24 wherein the plurality of pins comprises an input pin; and wherein the external control signal is received on the input pin.

26. A method according to claim 23 wherein each of the first and second scan compressor/decompressor configurations is enabled or bypassed for providing two corresponding operating modes.

27. A method according to claim 23 wherein the plurality of pins comprises a plurality of input and output pins; and further comprising a single logic core connected to the plurality of input and output pins; and wherein the first scan compressor/decompressor configuration comprises a first plurality of scan chains, and the second scan compressor/decompressor configuration comprises a second plurality of scan chains.

28. A method according to claim 27 wherein the scan compression architecture further comprises a multiplexer coupled between the plurality of output pins and the single logic core; and a demultiplexer coupled between the single logic core and the plurality of input; the multiplexer and the demultiplexer being configured based on a control signal for mapping the first and second plurality of scan chains for the first and second scan compressor/decompressor configurations.

29. A method according to claim 28 wherein operating modes of the first and second scan compressor/decompressor configurations are based on an additional control signal.

30. A method according to claim 29 wherein the operating modes include a first operating mode for selecting scan test patterns associated with the first scan compressor/decompressor configuration, and a second operating mode for selecting scan test patterns associated with the second scan compressor/decompressor configuration, the first scan compressor/decompressor configuration being connected to all of the plurality of input and output pins, and the second scan compressor/decompressor configuration being connected to a portion of the plurality of input and output pins.

31. A method according to claim 30 wherein the plurality of input pins are shared between the first and second operating modes; and wherein the first operating mode corresponds to a package level test and the second operating mode corresponds to an electrical wafer level test.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2007
From: CASARSA, MARCO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 019691/0309 →
Priority Claims (1)
EP 06009228 · May 4, 2006 · regional
Continuity (1)
Related Publication 20070283200A1 · Dec 6, 2007