IP Library Granted Patent US 7,704,327
Granted Patent B2
US 7,704,327 · App. 10/261,391 · Granted Apr 27, 2010

High temperature anneal with improved substrate support

Assignee: Applied Materials, Inc.
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Quick Facts
Patent No.
US 7,704,327
App. No.
10/261,391
Granted
Apr 27, 2010
Kind
B2
Abstract

A method including removing an impurity from a gas stream to a processing chamber at a point of use. An apparatus with a point of use purifier on a gas stream. An apparatus including a shelf having dimensions suitable for placement within a thermal processing including a body of a material that renders the body opaque to radiation frequency range used for a temperature measurement of a substrate in a thermal processing chamber.

Claims (4)

1. An apparatus comprising:

a thermal processing chamber having dimensions suitable for accommodating a substrate;

at least one source gas coupled to the chamber; and

a purifier coupled to the at least one source gas at a location adjacent to an inlet to the chamber, wherein the purifier is capable of removing at least one of oxygen and water from a stream of the source gas at a process flow rate, wherein the at least one source gas comprises hydrogen.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2003
From: WALDHAUER, ANN P.; CHACIN, JUAN M.; BURROWS, BRIAN H.
To: APPLIED MATERIALS, INC.
Reel/Frame 013831/0223 →
Continuity (1)
Related Publication 20040060512A1 · Apr 1, 2004