IP Library › Granted Patent US 7,704,331
Granted Patent B2
US 7,704,331 · App. 11/621,482 · Granted Apr 27, 2010

Technique for the growth of planar semi-polar gallium nitride

Assignees: The Regents of the University of California; Japan Science and Technology Agency
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,704,331
App. No.
11/621,482
Granted
Apr 27, 2010
Kind
B2
Abstract

A method for growing planar, semi-polar nitride film on a miscut spinel substrate, in which a large area of the planar, semi-polar nitride film is parallel to the substrate's surface. The planar films and substrates are: (1) {10 1 1} gallium nitride (GaN) grown on a {100} spinel substrate miscut in specific directions, (2) {10 1 3} gallium nitride (GaN) grown on a {110} spinel substrate, (3) {11 2 2} gallium nitride (GaN) grown on a {1 1 00} sapphire substrate, and (4) {10 1 3} gallium nitride (GaN) grown on a {1 1 00} sapphire substrate.

Claims (30)

1. A method for growing a nitride film, comprising growing a semi-polar nitride film on a substrate.

2. The method of claim 1 , wherein the semi-polar nitride film is grown parallel to the substrate's surface.

3. The method of claim 2 , wherein the substrate is a miscut substrate.

4. A semi-polar nitride film grown on a substrate.

5. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is a planar, semi-polar nitride film.

6. The semi-polar nitride film of claim 5 , wherein the planar, semi-polar nitride film is grown parallel to the substrate's surface.

7. The semi-polar nitride film of claim 6 , wherein the substrate is a miscut substrate.

8. The method of claim 1 , wherein the semi-polar nitride film is grown on a semi-polar plane of the substrate.

9. The method of claim 1 , wherein the semi-polar nitride film is {10-13} gallium nitride (GaN) and the substrate is a semi-polar substrate.

10. The method of claim 1 , wherein the semi-polar nitride film is {10-11} gallium nitride (GaN) and the substrate is a semi-polar substrate.

11. The method of claim 1 , wherein the semi-polar nitride film is {11-22} gallium nitride (GaN) and the substrate is a semi-polar substrate.

12. The method of claim 1 , wherein the semi-polar nitride film is a planar semi-polar nitride film.

13. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is grown on a semi-polar plane of the substrate.

14. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is {10-13} gallium nitride (GaN) and the substrate is a semi-polar substrate.

15. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is {10-11} gallium nitride (GaN) and the substrate is a semi-polar substrate.

16. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is {11-22} gallium nitride (GaN) and the substrate is a semi-polar substrate.

17. The method of claim 3 , wherein the planar, semi-polar nitride film is a {20-21} or {10-14} nitride film.

18. The method of claim 3 , wherein device layers are grown on the planar, semipolar nitride film by metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).

19. The method of claim 18 , wherein the planar, semi-polar nitride film is grown on the substrate by hydride vapor phase epitaxy (HVPE).

20. The method of claim 3 , wherein the planar, semi-polar nitride film is grown on the substrate by hydride vapor phase epitaxy (HVPE).

21. The method of claim 3 , wherein the substrate is a {100} substrate miscut in specific directions.

22. The method of claim 21 , wherein the specific directions comprise <001>, <010> or <011>.

23. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is comprised of a plurality of nitride layers.

24. The semi-polar nitride film of claim 6 , wherein the planar, semi-polar nitride film is a {20-21} or {10-14} nitride film.

25. The semi-polar nitride film of claim 6 , wherein device layers are grown on the planar, semipolar nitride film by metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).

26. The semi-polar nitride film of claim 25 , wherein the planar, semi-polar nitrid film is grown on the substrate by hydride vapor phase epitaxy (HVPE).

27. The semi-polar nitride film of claim 6 , wherein the planar, semi-polar nitride film is grown on the substrate by hydride vapor phase epitaxy (HVPE).

28. The semi-polar nitride film of claim 6 , wherein the substrate is a {100} substrate miscut in specific directions.

29. The semi-polar nitride film of claim 28 , wherein the specific directions comprise <001>, <010> or <011>.

30. The semi-polar nitride film of claim 4 , wherein the semi-polar nitride film is comprised of a plurality of nitride layers.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF ASSIGNEE PREVIOUSLY RECORDED ON REEL 019604 FRAME 0284. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 27, 2007
From: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
To: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Reel/Frame 019744/0808 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2007
From: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
To: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Reel/Frame 019604/0284 →
Continuity (3)
Continuation 1137291400 · Mar 10, 2006
Provisional Application 6066028300 · Mar 10, 2005
Related Publication 20070111531A1 · May 17, 2007