IP Library Granted Patent US 7,709,863
Granted Patent B2
US 7,709,863 · App. 11/243,910 · Granted May 4, 2010

Solid state imaging device

Assignee: Sony Corporation
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Quick Facts
Patent No.
US 7,709,863
App. No.
11/243,910
Granted
May 4, 2010
Kind
B2
Abstract

A solid state imaging device in which γ characteristic is obtained and enlargement of dynamic range is provided. The solid state imaging device of the present invention includes a vertical overflow function and has a feature in which potential of a semiconductor substrate is changed from a high potential to a low potential in a stepwise manner during a period from an exposure start to an exposure end.

Claims (8)

1. A solid state imaging device having a vertical overflow function, the solid state imaging device comprising:

a semiconductor substrate;

a p-type well region formed on the substrate;

a photosensor portion formed on the p-type well region, the photosensor portion including an n-type semiconductor region and a p-type charge accumulation region formed on the surface of the n-type semiconductor region; and

a substrate voltage value controller configured to change a potential applied to the semiconductor substrate from a high potential to a low potential in a stepwise manner during a period from an exposure start to an exposure end, thereby increasing a potential barrier of the p-type well region from a low state to a high state in a corresponding stepwise manner.

2. A solid state imaging device according to claim 1 , wherein an amount of a saturation current is controlled so as to become larger in a stepwise manner depending on the stepwise change of said semiconductor substrate potential.

3. A solid state imaging device according to claim 1 , wherein the substrate voltage value controller is configured to change the potential in a horizontal blanking period.

4. A solid state imaging device according to claim 1 , wherein the semiconductor substrate is an n-type substrate, and the solid state imaging device further comprises an n-type high impurity concentration region formed on the rear surface side of the semiconductor substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2005
From: KUMESAWA, TETSURO
To: SONY CORPORATION
Reel/Frame 016979/0874 →
Priority Claims (1)
JP P2004-292873 · Oct 5, 2004 · national
Continuity (1)
Related Publication 20060022223A1 · Feb 2, 2006