Method for forming insulation film having high density
A method for forming an insulation film on a semiconductor substrate by plasma reaction includes: introducing into a reaction chamber a source gas of a silicon-containing hydrocarbon compound comprising in its molecule at least one Si—O bond and at least one bond selected from the group consisting of a Si—Si bond, Si—N bond, and Si—H bond; introducing into the reaction chamber an additive gas constituted by C, H, and optionally O; controlling a susceptor at a temperature of −50° C. to 50° C.; forming by plasma reaction an insulation film constituted by Si, O, H, and optionally N on an irregular surface of a substrate at a deposition rate of 100 nm/min or less; and heat-treating the substrate with the insulation film, thereby increasing a density of the insulation film to more than 2.1 g/cm 3 as a result of the heat treatment.
1. A method for forming an insulation film on a semiconductor substrate by plasma reaction, comprising:
providing a substrate having an irregular surface including concave portions placed on a susceptor in a reaction chamber;
introducing into the reaction chamber a process gas comprising: (i) a source gas of a silicon-containing hydrocarbon compound comprising in its molecule at least one Si—O bond and at least one bond selected from the group consisting of a Si—Si bond, Si—N bond, and Si—H bond; (ii) an additive gas constituted by C, H, and optionally O; (iii) an oxidizing gas; and (iv) an inert gas;
controlling the temperature of the susceptor at −50° C. to 50° C., and flow rates of the respective gases to satisfy the following relationship: (i)<(iii)<(ii)<(iv); and
depositing by plasma reaction an insulation film constituted by Si, O, H, and optionally N on the irregular surface of the substrate including the concave portions at a deposition rate of 100 nm/mm or less.
2. The method according to claim 1 , further comprising heat-treating the substrate with the insulation film, thereby increasing a density of the insulation film to more than 2.12 g/cm 3 as a result of the heat treatment.
3. The method according to claim 2 , wherein the heat-treating step is performed by thermal annealing or UV curing.
4. The method according to claim 3 , wherein the annealing step is performed at a temperature of 200° C. to 1,100° C.
5. The method according to claim 1 , further comprising, as a preliminary treatment, introducing an auxiliary gas selected from the group consisting of oxidizing gas, inert gas, and a gas constituted by C, H, and optionally O into the reaction chamber for plasma treatment of the substrate before introducing the reaction gas.
6. The method according to claim 5 , wherein the auxiliary gas is He or H 2 .
7. The method according to claim 5 , wherein the auxiliary gas is isopropyl alcohol, acetone, or hexane.
8. The method according to claim 1 , wherein a flow rate of the source gas is no more than 2.8% of the total flow rate of the process gas.
9. The method according to claim 1 , wherein the additive gas is isopropyl alcohol or acetone.
10. The method according to claim 1 , wherein the irregular surface has a three-dimensional structure of aluminum, tungsten, or tungsten silicon.
11. The method according to claim 1 , wherein the insulation film has a thickness of 25 nm to 70 nm.
12. The method according to claim 1 , wherein the irregular surface with the concave portion is a patterned surface for wiring.
13. The method according to claim 1 , wherein the concave portion of the irregular surface of the substrate has an aspect ratio of about 1/3 to about 1/10.
14. The method according to claim 1 , wherein the concave portion of the irregular surface has holes or grooves, and the deposition step is performed on the irregular surface to fill the holes or grooves with the insulation film.
15. The method according to claim 1 , wherein the insulation film is a silicon oxide film.
16. The method according to claim 15 , wherein at least one X is neither H nor OH in each formula.
17. The method according to claim 1 , wherein said silicon-containing hydrocarbon compound is at least one compound selected from the group consisting of:
wherein each X is independently H, OH, CH 3 , C 2 H 5 , OCH 3 , or OC 2 H 5 , and Y is H, CH 3 , or C 2 H 5 .
18. A method for forming an interconnect structure, comprising the steps of:
forming a three-dimensional structure for interconnect in a substrate; and
forming an insulation layer on a surface of the three-dimensional structure using the method of claim 1 .
19. The method according to claim 18 , further comprising wet-etching the insulation film.
20. The method according to claim 18 , wherein the step of forming a three-dimensional structure comprises forming a layer of aluminum, tungsten, or tungsten silicon as a wiring layer and etching the layer in a pattern.
21. The method according to claim 1 , wherein ratios of the flow rates of the respective gases are controlled to satisfy the following relationship: (i)/(iv)/(iii)/(ii)=(10)/(100-10000)/(15-100)/(20-300).
22. The method according to claim 1 , wherein the ratios of the flow rates of the respective gases are controlled to satisfy the following relationship: (i)/(iv)/(iii)/(ii)=(10)/(500-2000)/(20-80)/(40-200).