On-chip magnetic components
View Patent ↗An integrated circuit chip comprising a bond wire and a mass of magnetic material provided on the bond wire, wherein the mass of magnetic material increases the inductance of the bond wire.
1. A semiconductor chip comprising:
a bond wire; and
a mass of magnetic material provided on the bond wire, the mass of magnetic material comprising magnetic particles suspended in a binder material, the mass of magnetic material not contacting the chip, wherein the mass of magnetic material increases the inductance of the bond wire.
2. The chip of claim 1 , wherein the bond wire extends beyond a plane of a surface of the chip.
3. The chip of claim 2 , wherein the bond wire extends from a point on the chip surface to a separate component to which the chip is electrically connected.
4. The chip of claim 2 , wherein the bond wire extends between two discrete points on the chip surface.
5. The chip of claim 1 , wherein the mass of magnetic material comprises a bead of magnetic material that is provided on a portion of the bond wire that extends beyond a plane of a surface of the chip.
6. The chip of claim 1 , wherein the mass of magnetic material substantially covers a portion of the bond wire that extends beyond a plane of a surface of the chip.
7. The chip of claim 1 , wherein the magnetic particles comprise ferrite particles.
8. The chip of claim 7 , wherein the ferrite particles comprise powdered ferrite material.
9. The chip of claim 7 , wherein the ferrite particles comprise a ferrite nanocomposite.
10. The chip of claim 1 , wherein the binder material comprises an epoxy.
11. The chip of claim 1 , wherein the binder material comprises a thermoplastic resin.
12. A semiconductor chip comprising:
multiple bond wire; and
a mass of magnetic material provided on the bond wires, the mass of magnetic material comprising magnetic particles suspended in a binder material, the mass of magnetic material not contacting the chip, wherein the mass of magnetic material increases the inductance of the bond wires.
13. The chip of claim 12 , wherein the bond wires are not directly connected to each other.
14. The chip of claim 12 , wherein the bond wires are directly connected to each other in series.
15. The chip of claim 1 , wherein the chip is a power management integrated circuit chip.
16. A power system-on-chip that integrates substantially all active and passive components used in power management, the power system-on-chip comprising:
a top surface;
a conductive bond wire that comprises a portion that extends upwardly beyond the plane of the top surface; and
a mass of magnetic material that encapsulates at least part of the bond wire portion but does not contact the chip, the mass comprising a ferrite material that is suspended within a binder material, wherein the mass of magnetic material increases the inductance of the bond wire.
17. The power system-on-chip of claim 16 , wherein the mass of magnetic material substantially encapsulates the entirety of the bond wire portion that extends upwardly beyond the plane of the top surface.
18. The power system-on-chip of claim 16 , wherein the mass of magnetic material substantially encapsulates the entire bond wire.
19. The power system-on-chip of claim 16 , wherein the ferrite material comprises a powdered ferrite material.
20. The power system-on-chip of claim 16 , wherein the ferrite material comprises ferrite nanocomposite.
21. The power system-on-chip of claim 16 , wherein the binder material comprises an epoxy.
22. The power system-on-chip of claim 16 , wherein the binder material comprises a thermoplastic resin.
23. A power system-on-chip that integrates substantially all active and passive components used in power management, the power system-on-chip comprising:
a top surface;
multiple bond wires that extend upwardly beyond the plane of the top surface; and
a mass of magnetic material that encapsulates at least part of the bond wire portions but does not contact the chip, the mass comprising a ferrite material that is suspended within a binder material, wherein the mass of magnetic material increases the inductance of the bond wires.
24. The power system-on-chip of claim 16 , wherein the bond wire exhibits a quality factor of approximately 30-40.