Electronic devices having air gaps
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
1. An electronic device comprising a first layer comprising metal lines and a sacrificial material layer disposed between the metal lines, and a second layer disposed over the metal lines and the sacrificial material; wherein the sacrificial material layer comprises a cross-linked polymer containing as polymerized units one or more monomers chosen from (meth)acrylic acid, (meth)acrylamides, alkyl (meth)acrylates, alkenyl(meth)acrylates, aromatic (meth)acrylates, vinyl aromatic monomers, nitrogen-containing compounds and their thio-analogs, substituted ethylene monomers, cyclic olefins, and substituted cyclic olefins.
2. An electronic device comprising metal lines and a sacrificial material disposed between the metal lines, and an overlayer material disposed over the sacrificial material and adjacent to the metal lines, wherein the sacrificial material layer comprises a cross-linked polymer containing as polymerized units one or more monomers chosen from (meth)acrylic acid, (meth)acrylamides, alkyl (meth)acrylates, alkenyl (meth)acrylates, aromatic (meth)acrylates, vinyl aromatic monomers, nitrogen-containing compounds and their thio-analogs, substituted ethylene monomers, cyclic olefins, and substituted cyclic olefins.
3. The device of claim 2 wherein the overlayer material is porous.
4. An electronic device comprising copper lines formed on a substrate, the copper lines having one or more copper diffusion barriers disposed thereon, air gaps formed between at least a portion of the copper lines and the copper diffusion barriers, and a porous overlayer material disposed over the copper diffusion barrier and the air gaps, wherein the copper diffusion barrier comprises metal atoms.