IP Library Granted Patent US 7,732,805
Granted Patent B2
US 7,732,805 · App. 12/119,838 · Granted Jun 8, 2010

Image sensor and method for manufacturing the same

Assignee: Dongbu Hitek Co., Ltd.
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Quick Facts
Patent No.
US 7,732,805
App. No.
12/119,838
Granted
Jun 8, 2010
Kind
B2
Abstract

An image sensor and a method for manufacturing the same are provided. The image sensor can include transistor circuitry on a substrate, and a photodiode arranged above the transistor circuitry. The photodiode can include carbon nanotubes and a conductive polymer layer on the carbon nanotubes. A transparent conducting electrode can be provided on the carbon nanotubes.

Claims (32)

1. An image sensor comprising:

a substrate including transistor circuitry;

a lower interconnection on the substrate connected to the transistor circuitry

a first conductive-type conductive layer on the lower interconnection;

an intrinsic layer on the first conductive-type conductive layer;

carbon nanotubes on the intrinsic layer; and

a conductive polymer layer coated on the carbon nanotubes,

wherein the carbon nanotubes are doped with a second conductive-type material.

2. The image sensor according to claim 1 , wherein the conductive polymer layer comprises a color polymer.

3. The image sensor according to claim 1 , further comprising a transparent conducting electrode on the carbon nanotubes.

4. An image sensor comprising:

a substrate including transistor circuitry;

a lower interconnection on the substrate connected to the transistor circuitry;

carbon nanotubes on the lower interconnection;

an intrinsic layer on the carbon nanotubes;

a second conductive-type conductive layer on the intrinsic layer; and

a conductive polymer layer on the second conductive-type conductive layer,

wherein the carbon nanotubes are doped with a first conductive-type material.

5. The image sensor according to claim 4 , wherein the conductive polymer layer comprises a color polymer.

6. The image sensor according to claim 4 , further comprising a transparent conducting electrode on the carbon nanotubes.

7. An image sensor comprising:

a substrate including transistor circuitry;

a lower interconnection on the substrate connected to the transistor circuitry;

carbon nanotubes on the lower interconnection;

a conductive polymer layer coated on the carbon nanotubes; and

a silicon-based conductive layer contacting the conductive polymer coated carbon nanotubes.

8. The image sensor according to claim 7 , wherein the carbon nanotubes are doped with a second conductive-type material.

9. The image sensor according to claim 8 , wherein the Si-based conductive layer contacting the conductive polymer coated carbon nanotubes is of a first conductive-type and is disposed below the carbon nanotubes.

10. The image sensor according to claim 7 , wherein the carbon nanotubes are doped with a first conductive-type material.

11. The image sensor according to claim 10 , wherein the Si-based conductive layer contacting the conductive polymer coated carbon nanotubes is of a second conductive-type and is disposed on the carbon nanotubes.

12. The image sensor according to claim 7 , wherein the conductive polymer layer comprises a color polymer.

13. The image sensor according to claim 7 , further comprising a transparent conducting electrode on the carbon nanotubes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2008
From: SHIM, CHEON MAN
To: DONGBU HITEK CO., LTD.
Reel/Frame 020962/0109 →
Priority Claims (1)
KR 10-2007-0047589 · May 16, 2007 · national
Continuity (1)
Related Publication 20080283883A1 · Nov 20, 2008