Hybrid integrated circuit device and method for manufacturing same
A hybrid integrated circuit device includes: an insulating substrate ( 1 ) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components ( 3 ) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs ( 2 ) arranged at the ends of the lower surface of the substrate ( 1 ), each insulating leg extending in parallel to the lower surface of the substrate ( 1 ); and a plurality of terminal electrodes ( 5 ) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate ( 1 ). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes. Each leg is fixed to the substrate by attaching the terminal electrodes to the wiring patterns on the lower surface of the substrate ( 1 ) by soldering or by an electroconductive paste.
1. A hybrid integrated circuit device comprising:
an insulating substrate including an upper surface and a lower surface, the lower surface being formed with a plurality of wiring patterns for external connection, the plurality of wiring patterns including ends arranged along edges of the lower surface at a predetermined pitch;
electronic components mounted on at least one of the upper surface and the lower surface of the insulating substrate, the electronic components being connected to the wiring patterns;
a pair of insulating legs arranged at the edges of the lower surface of the insulating substrate, each of the insulating legs extending in parallel to the lower surface of the insulating substrate; and
a plurality of terminal electrodes formed on each of the legs at the predetermined pitch to extend perpendicularly to the insulating substrate, the plurality of terminal electrodes being connected to corresponding ones of the wiring patterns formed on the lower surface of the insulating substrate;
wherein each of the legs is bonded to the insulating substrate and formed with a plurality of electrode films connected to the terminal electrodes,
wherein each of the legs is fixed to the insulating substrate by attaching the terminal electrodes to the corresponding ones of the wiring patterns on the lower surface of the insulating substrate by soldering or by adhesion of an electroconductive paste,
wherein each of the legs includes an outer side surface formed with a plurality of outer side grooves arranged at a predetermined pitch, and an inner side surface formed with a plurality of inner side grooves arranged correspondingly to the outer side grooves, the terminal electrodes being provided in the inner side grooves and the outer side grooves, and
wherein the electrode films connect the terminal electrodes in the outer side grooves to corresponding ones of the terminal electrodes in the inner side grooves.
2. A method for manufacturing a hybrid integrated circuit device, the method comprising:
mounting an electronic component on an upper surface or a lower surface of an insulating substrate, the lower surface being formed with a plurality of wiring patterns for external connection, the wiring patterns having ends arranged along an edge of the lower surface at a predetermined pitch;
preparing an elongated, insulating leg being provided with a plurality of terminal electrodes arranged at the predetermined pitch in a longitudinal direction of the leg, the leg being attached to the insulating substrate and formed with a plurality of electrode films connected to the terminal electrodes; and
fixing the leg to the edge of the lower surface of the insulating substrate by attaching the terminal electrodes on the leg to corresponding ones of the wiring patterns on the lower surface of the insulating substrate through soldering or through adhesion of an electroconductive paste;
wherein the leg includes an outer side surface formed with a plurality of outer side grooves arranged at a predetermined pitch, and an inner side surface formed with a plurality of inner side grooves arranged correspondingly to the outer side grooves, the terminal electrodes being formed in the inner side grooves and the outer side grooves, and
wherein the electrode films connect the terminal electrodes in the outer side grooves to corresponding ones of the terminal electrodes in the inner side grooves.
3. The method according to claim 2 , wherein the preparing of the leg comprises:
preparing a material board integrally including a plurality of legs arranged side by side;
forming a plurality of through-holes in the material board at the predetermined pitch along a boundary line between adjacent legs;
forming an electrode in each of the through-holes to form a via hole for providing a terminal electrode, and forming an electrode film on each of an upper surface and a lower surface of the material board to connect a plurality of via holes aligned in a direction perpendicular to the boundary line; and
cutting the material board along the boundary line to provide separate legs.