Optimization of electronic package geometry for thermal dissipation
View Patent ↗An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thicknesses along its length to enhance the dissipation of heat.
1. A electronic package device, comprising:
a microelectronic package;
a heat sink positioned over the microelectronic package; and
a thermal interface element for dissipating heat, the thermal interface element being elongated and having differing thicknesses along a length, and the thermal interface element being positioned between the microelectronic package and the heat sink; and
a lid positioned over the microelectronic package, the lid including a convex top surface and a convex bottom surface;
a first thermal interface element positioned between and mating with the convex top surface of the lid and the heat sink to provide a concavely shaped first thermal interface element for dissipating heat; and
a second thermal interface element positioned between the convex bottom surface of the lid and a chip within the microelectronic package to provide a concavely shaped second thermal interface element for dissipating heat.
2. The device of claim 1 , wherein the thermal interface element includes a middle region having a first thickness along a specified length of the element.
3. The device of claim 1 , wherein the thermal interface element includes a middle region having a first thickness along a first specified length of the element, and two end regions substantially continuous with the middle region each having a second thickness along second specified lengths of the element.
4. The device of claim 3 , wherein the first specified length of the element has a first thickness that is less than a second thickness of the second specified lengths of the element.
5. The device of claim 1 , wherein the microelectronic package includes a lid having a convex top surface and a flat bottom surface and the top surface is adjacent to and mates with the thermal interface element to provide a concavely shaped thermal interface element.
6. The device of claim 1 , wherein the thermal interface element is a liquid, film, paste or a gel which is secured to the microelectronic package and the heat sink by heat or pressure or a combination of both.
7. The device of claim 1 , wherein the microelectronic package includes at least one chip positioned in a cavity defined by the lid and chip carrier, the microelectronic package positioned over solder balls connected to a top surface of a circuit board.
8. The device of claim 7 , further including a thermal interface material (TIM) positioned over the at least one chip and contacting an underside of the lid.
9. The device of claim 7 , further including a plurality of chips.
10. A method for dissipating heat in an electronic package, comprising:
providing a microelectronic package;
positioning a heat sink over the microelectronic package;
positioning a thermal interface element between the microelectronic package and the heat sink for dissipating heat from the microelectronic package;
shaping a mating surface area of the microelectronic package to provide a varying thickness along a length of the thermal interface element;
positioning a lid over the microelectronic package, the lid including a convex top surface and a convex bottom surface;
layering a first thermal interface element between and mating with the convex top surface of the lid and the heat sink to provide a concavely shaped first thermal interface element for dissipating heat; and
layering a second thermal interface element between the convex bottom surface of the lid and a chip within the microelectronic package to provide a concavely shaped second thermal interface element for dissipating heat.