Substrate processing method and substrate processing apparatus
View Patent ↗A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12 , polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
1. A substrate processing method for polishing a peripheral portion of a substrate, said method comprising:
rotating the substrate by a motor;
polishing a first surface of the peripheral portion of the substrate by pressing a polishing surface of a polishing mechanism against the first surface while rotating the substrate;
determining a polishing end point of the first surface during said polishing by monitoring a polished state of the first surface;
stopping said polishing according to said determining of the polishing end point;
determining a polishing time spent for said polishing;
determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface; and
polishing the second surface for the determined polishing time with the polishing surface inclined along the second surface.
2. The substrate processing method according to claim 1 , wherein:
the first surface comprises an end surface substantially perpendicular to a front surface of the substrate; and
the second surface comprises an upper sloping surface and a lower sloping surface which are adjacent to the first surface.
3. The substrate processing method according to claim 1 , wherein said determining of the polishing end point comprises:
monitoring a load of the motor;
measuring an average load per unit time of the motor; and
detecting a load changing point at which the average load exceeds a predetermined value.
4. The substrate processing method according to claim 3 , wherein a point at which a predetermined time has elapsed from the load changing point is set as a polishing end time of the first surface.
5. The substrate processing method according to claim 1 , wherein said determining the polishing end point comprises:
measuring a surface temperature of the substrate; and
detecting an increase of the surface temperature to a predetermined value.
6. The substrate processing method according to claim 1 , wherein the polishing mechanism comprises a polishing tape having the polishing surface, and a polishing head for pressing said polishing tape against the peripheral portion of the substrate.
7. A substrate processing method for polishing a peripheral portion of a substrate, said method comprising:
rotating the substrate by a motor;
polishing the peripheral portion of the substrate by pressing a polishing surface of a polishing mechanism against the peripheral portion while rotating the substrate;
monitoring a load of the motor during said polishing;
measuring an average load per unit time of the motor during said polishing and a load fluctuation magnitude with respect to the average load;
comparing the load fluctuation magnitude with a threshold value; and
determining an occurrence of an anomaly in said polishing when the load fluctuation magnitude exceeds the threshold value.
8. The substrate processing method according to claim 7 , wherein said polishing is stopped when the occurrence of the anomaly in said polishing is determined.
9. The substrate processing method according to claim 7 , wherein the polishing mechanism comprises a polishing tape having the polishing surface and a polishing head for pressing said polishing tape against the peripheral portion of the substrate.
10. The substrate processing method according to claim 7 , wherein said monitoring the load of the motor is performed continuously or intermittently.
11. A substrate processing method for polishing a peripheral portion of a substrate, said method comprising:
rotating the substrate by a motor;
polishing the peripheral portion of the substrate by pressing a polishing surface of a polishing mechanism against the peripheral portion while rotating the substrate;
monitoring a load of the motor during said polishing;
measuring an average load per unit time of the motor during said polishing and a load fluctuation magnitude with respect to the average load;
detecting a load changing point at which the average load exceeds a predetermined value; and
determining a polishing end time of the peripheral portion based on the load changing point and the load fluctuation magnitude.
12. The substrate processing method according to claim 11 , wherein:
a point at which a predetermined time has elapsed from the load changing point is set as the polishing end time; and
the predetermined time varies in proportion to the load fluctuation magnitude.
13. The substrate processing method according to claim 11 , wherein the polishing mechanism comprises a polishing tape having the polishing surface, and a polishing head for pressing said polishing tape against the peripheral portion of the substrate.
14. The substrate processing method according to claim 11 , wherein said monitoring the load of the motor is performed continuously or intermittently.