Passivation layer for a circuit device and method of manufacture
According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter 2 /day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 10 15 ohm-centimeter, and a defect density less than 0.5/centimeter 2 .
1. A method for manufacturing an integrated circuit comprising:
providing a substrate having a substrate surface;
forming an electrical component comprising at least a transistor or a capacitor on the substrate surface;
coating the substrate surface and electrical component with a first protective dielectric layer made of alumina, the first protective dielectric layer having a thickness that is in the range of approximately 50 to 2000 angstroms;
etching a portion of the first protective dielectric layer from the substrate surface or the electrical component in order to form a contact surface;
forming an air bridge on the contact surface;
coating the first protective dielectric layer, the electrical component, and the air bridge with a second protective dielectric layer made of alumina, the second protective dielectric layer having a thickness that is in the range of approximately 50 to 2000 angstroms;
applying an adhesion promoter to the second protective dielectric layer; and
coating the second protective dielectric layer with a third dielectric layer made of alumina, silica, parylene F, aromatic-fluorinated VT-4, and parylene HT®, the third dielectric layer having a thickness that is in the range of approximately 100 to 1000 angstroms.
2. The method of claim 1 , wherein the act of applying an adhesion promoter comprises applying an adhesion promoter comprising a layer of silicon dioxide used independently or in conjunction with gamma-methacryloxypropyltrimethoxysilane.
3. The method of claim 1 , wherein the act of providing a substrate comprises providing a substrate made of a material selected from the group consisting of silicon (Si), gallium-arsenide (GaAs), Gallium-Nitride (GaN), germanium (Ge), silicon-carbide (SiC), and indium-phosphide (InP).