Method of manufacturing a micro-mechanical element

1. Method of manufacturing a micro-mechanical element, the method comprising the steps of:

providing a layer of base material;

applying at least one partly sacrificial layer of an etchable material;

patterning the partly sacrificial layer to define at least a portion of the shape of the element, wherein the element comprises at least one structural layer;

applying the at least one structural layer of a mechanical material, the at least one structural layer consisting entirely of titanium nitride;

patterning the structural layer to form at least a portion of the element; and

removing at least partly the patterned at least partly sacrificial layer to at least partly free the element.

2. Method according to claim 1 , whereby the etchable material is selected from the group of silicon-based materials.

3. Method according to claim 2 , whereby the etchable material contains silicon nitride.

4. Method according to claim 3 , whereby the etch rate of the silicon nitride is increased by increasing the hydrogen content.

5. Method according to claim 2 , whereby the etchable material contains amorphous silicon.

6. Method according to claim 2 , whereby the etchable material contains silicon oxide.

7. Method according to claim 2 , whereby the etchable material contains spin-on glass.

8. Method according to claim 1 , whereby the etchable material contains a polymer.

9. Method according to claim 2 , whereby the at least partly removing of the patterned at least partly sacrificial layer includes using a fluorine gas in an etching process.

10. Method according to claim 8 , whereby the at least partly removing of the patterned at least partly sacrificial layer includes using oxygen gas in a plasma etching process.

11. Method according to claim 1 , further including the steps of: applying at least one conductive layer of a conductive material; and patterning the conductive layer to form at least a portion of at least one first electrode.

12. Method according to claim 11 , whereby the conductive material contains titanium.

13. Method according to claim 12 , whereby the conductive material contains titanium nitride.

14. Method according to claim 11 , whereby the conductive material contains platinum.

15. Method according to claim 11 , whereby during at least partly removing of the patterned at least partly sacrificial layer a controlled amount of a material is removed from at least part of the surface of the first electrode.

16. Method according to claim 1 , whereby during the at least partly removing of the patterned at least partly sacrificial layer a controlled amount of material is removed from at least part of the surface of the free part of the element.

17. A method of manufacturing a micro-mechanical element, comprising:

depositing a first conductive layer over a substrate;

patterning the first conductive layer to expose the substrate and form a patterned first conductive layer and a first electrode;

depositing a sacrificial layer over the patterned first conductive layer, the first electrode and the exposed substrate;

patterning the sacrificial layer to expose the patterned first conductive layer;

depositing a second conductive layer comprising titanium nitride on the exposed patterned first conductive layer and the patterned sacrificial layer;

patterning the second conductive layer to form a micro-mechanical element in contact with the patterned first conductive layer and the patterned sacrificial layer, the micro-mechanical element consisting entirely of the second conductive layer; and

removing the patterned sacrificial layer such that a portion of the micro-mechanical element is spaced from the first electrode.

18. The method of claim 17 , wherein the first conductive layer comprises titanium nitride.

19. The method of claim 17 , wherein the sacrificial layer comprises spin on glass.