IP Library › Granted Patent US 7,793,395
Granted Patent B2
US 7,793,395 · App. 11/687,734 · Granted Sep 14, 2010

Method for manufacturing a film bulk acoustic resonator

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,793,395
App. No.
11/687,734
Granted
Sep 14, 2010
Kind
B2
Abstract

A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.

Claims (12)

1. A method for manufacturing a film bulk acoustic resonator comprising:

vapor-depositing a membrane on a substrate;

forming protection layers on the substrate which abut two sides of the membrane;

vapor-depositing a laminated resonance part on the membrane; and

forming an air gap by removing a part of the substrate disposed between the protection layers.

2. The manufacturing method of claim 1 , wherein the protection layers are formed by a LOCOS process.

3. The manufacturing method of claim 1 , wherein the step of vapor-depositing a laminated resonance part comprises:

vapor-depositing a lower electrode on the membrane;

vapor-depositing a piezoelectric layer on the lower electrode; and

vapor-depositing an upper electrode on the piezoelectric layer.

4. The manufacturing method of claim 1 , wherein the air gap is formed by dry etching.

5. The manufacturing method of claim 1 , wherein the air gap is formed by wet etching.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2010
From: HA, BYEOUNG-JU; PARK, YUN-KWON; SONG, IN-SANG; SONG, IL-JONG; KIM, JONG-SEOK; KIM, DUCK-HWAN; HWANG, JUN-SIK
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 024880/0547 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2007
From: MAECKE, HELMUT ROBERT; REUBI, JEAN CLAUDE; RINK, HANS; EISENWIENER, KLAUS-PETER
To: UNIVERSITY OF BERN; UNIVERSITY HOSPITAL BASEL
Reel/Frame 019340/0618 →
Priority Claims (1)
KR 2003-69838 · Oct 8, 2003 · national
Continuity (2)
Division 1092956900 · Aug 31, 2004
Related Publication 20070157442A1 · Jul 12, 2007