IP Library › Granted Patent US 7,798,881
Granted Patent B2
US 7,798,881 · App. 12/190,666 · Granted Sep 21, 2010

Electroluminescence display and method for manufacturing the same

Assignee: Industrial Technology Research Institute
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Quick Facts
Patent No.
US 7,798,881
App. No.
12/190,666
Granted
Sep 21, 2010
Kind
B2
Abstract

An electroluminescence display and a manufacturing method therefore are disclosed in the present invention. The present invention combines an electroluminescence component and a passive component into a single display component for a display screen. The present invention has a simple manufacturing process, and decreases power consumption and the total size of a display screen.

Claims (26)

1. A manufacturing method for an electroluminescence display, comprising the following steps:

providing an upper substrate and a bottom substrate;

forming a conductive layer on said bottom substrate;

forming a plurality of wall structures on said conductive layer;

filling a plurality of liquid crystal display media on at least one first space, wherein the at least one first space is formed by said wall structures;

forming a plurality of organic materials on at least one second space, wherein the at least one second space is formed by said wall structures;

making a plurality of seals and at least one third space on said conductive layer;

forming a protective layer on said liquid crystal display media; and

combining said upper substrate and said bottom substrate.

2. The method as claimed in claim 1 , wherein the electroluminescence display is a passive reflective component or a passive transparent component.

3. The method as claimed in claim 1 , wherein the upper substrate and the bottom substrate are a plastic substrate, metal-foil substrate or a glass substrate.

4. The method as claimed in claim 3 , wherein the material of the plastic substrate is Polyethylene terephthalate (PET), Polyethersulfone (PES), Polycarbonate, photopolymer resin or thermosetting resin.

5. The method as claimed in claim 1 , further comprising forming a color filter on the upper substrate.

6. The method as claimed in claim 1 , wherein the step of forming the wall structures on the conductive layer further comprises:

forming a photosynthesis layer on said conductive layer;

forming a photoresistant layer on said photosynthesis layer; and

using a mask to define and form said wall structures.

7. The method as claimed in claim 6 , wherein the photosynthesis layer is formed via a coating process.

8. The method as claimed in claim 6 , wherein the photoresistant layer is formed via a coating process.

9. The method as claimed in claim 6 , wherein the wall structures are formed via an etching process.

10. The method as claimed in claim 1 , wherein the step of filling is performed via a one-drop-fill process.

11. The method as claimed in claim 1 , wherein the organic materials are formed via a distillation process.

12. The method as claimed in claim 1 , wherein the organic materials are made of an organic light-emitting diode.

13. The method as claimed in claim 1 , wherein the protective layer is formed via a polymerization induced ultraviolet exposure.

14. The method as claimed in claim 1 , wherein the step of combining is performed via a pressing process.

15. The method as claimed in claim 1 , wherein the step of combining is performed via an ultraviolet exposure.

Priority Claims (1)
TW 94129716 A · Aug 30, 2005 · national
Continuity (2)
Division 1135696900 · Feb 21, 2006
Related Publication 20080299863A1 · Dec 4, 2008