Processing method and storage medium
A processing method includes a gas having a Si—CH 3 bond supplied into a processing chamber after a target substrate to be processed is loaded into the processing chamber; and a silylation process performed on the target substrate. The internal pressure of the chamber by the supply of the gas having the Si—CH 3 bond and the gas supply time are set to be within ranges where the silylation process can be performed while the internal pressure of the chamber is decreased to reach an eligible pressure level where the wafer can be unloaded after the internal pressure of the chamber is increased up to a preset pressure by the supply of the gas.
1. A processing method comprising:
supplying a gas having a Si—CH 3 bond into a processing chamber after a target substrate to be processed is loaded into the processing chamber; and
performing a silylation process on the target substrate,
wherein the internal pressure of the chamber by the supply of the gas having the Si—CH 3 bond and the gas supply time are set to be within ranges where the silylation process can be performed, while the internal pressure of the chamber is decreased to reach an eligible pressure level where the wafer can be unloaded after the internal pressure of the chamber is increased up to a preset pressure by the supply of the gas,
wherein after the internal pressure of the chamber reaches the preset pressure by the supply of the gas having the Si—CH 3 bond, the internal pressure of the chamber is decreased gradually without being maintained at the target pressure.
2. The processing method of claim 1 , wherein the gas having the Si—CH 3 bond is made up of at least one of TMSDMA (Dimethylaminotrimethylsilane), TMMAS (Trimethylmethylaminosilane), TMICS (Trimethyl(isocyanato)silane), TMSA (Trimethylsilylacetylene), and TMSC (Trimethylsilylcyanide).
3. The processing method of claim 1 , wherein the preset pressure is about 1333 Pa (10 Torr).
4. The processing method of claim 1 , wherein the silylation process is performed while the temperature of the target substrate is kept at about 100° C. or greater.
5. A computer readable storage medium for storing therein a computer executable control program for controlling a processing apparatus, wherein, the control program, when executed, controls the processing apparatus to perform the processing method described in claim 1 .