Method for fabricating large dimension bonds using reactive multilayer joining
A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
1. A method of forming a bonded plate assembly, comprising the steps of:
providing a brass plate having a top surface, and pre-wetting the top surface with a solder layer;
providing a nickel plate having a bottom surface, and pre-wetting the bottom surface with a solder layer;
introducing a plurality of discrete pieces of bonding foil in a laterally adjacent and spaced apart arrangement in a common plane parallel to, and between, the top surface of the brass plate and the bottom surface of the nickel plate, wherein each discrete piece of the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction;
interconnecting each spaced apart and laterally adjacent discrete piece of bonding foil with at least one bridge structure capable of transferring an exothermic reaction across an interspatial gap separating one laterally adjacent piece from another; and,
pressing the brass plate and the nickel plate together and initiating an exothermic reaction in at least one of said discrete pieces of the bonding foil introduced there between to melt and bond the solder layer on the brass plate with the solder layer on the nickel plate without affecting the microstructure or flatness of the nickel plate in the formation of the bonded plate assembly.
2. The method of forming the bonded plate assembly of claim 1 , further comprising,
aligning the nickel plate and the brass plate in a press, prior to pressing and thereafter applying a load in excess of at least 50,000 lbs.
3. The method of forming the bonded plate assembly of claim 1 , wherein the solder layers are tin-lead solder.
4. The method of forming the bonded plate assembly of claim 1 , wherein the solder layers are of substantially the same thickness.
5. The method of forming the bonded plate assembly of claim 1 , further comprising electrically igniting at least one discrete piece of the bonding foil to initiate the exothermic reaction.
6. The method of forming the bonded plate assembly of claim 1 , wherein the thickness of each discrete piece of the bonding foil falls within the range from about 0.002 to about 0.003 inches.
7. The method of forming the bonded plate assembly of claim 1 , wherein the solder layers have a thickness that falls within the range from about 0.005 to 0.010 inches.
8. The method of forming the bonded plate assembly of claim 1 , wherein the pressure is applied via a hydraulic press, screw or manual press.
9. The method of forming the bonded plate assembly of claim 1 , wherein each discrete piece of the bonding foil is selected so that the alternating layers within the foil produce silicides, aluminides, borides, carbides, thermite reacting compounds, alloys, metallic glasses and composites upon reaction.
10. The method of forming the bonded plate assembly of claim 1 , wherein the solder material is selected from among indium-tin, tin-lead, or tin-silver-copper.
11. The method of forming the bonded assembly of claim 1 , wherein the nickel plate is a substantially circular, disc-shaped plate.
12. A large area bonded plate assembly comprising:
a brass plate, a nickel plate, and a plurality of laterally adjacent discrete pieces of bonding foil disposed in a spaced-apart arrangement in a common plane parallel to and between said brass plate and said nickel plate, each laterally adjacent discrete piece of bonding foil interconnected to at least one additional discrete piece of bonding foil by a bridging structure capable of transferring an exothermic reaction across a gap between said laterally adjacent discrete pieces of said bonding foil, wherein each discrete piece of the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction in order to bond the brass plate to the nickel plate at adjacent surfaces without affecting the microstructure or the flatness of the plates in the formation of the bonded plate assembly.
13. The bonded plate assembly of claim 12 , further comprising a first solder bond layer disposed between the brass plate and the plurality of pieces of the bonding foil and a second bond layer between the nickel plate and the plurality of pieces of the bonding foil.
14. The bonded plate assembly of claim 12 , wherein the thickness of each piece of the bonding foil falls within the range from about 0.002 to about 0.003 inches.
15. The bonded plate assembly of claim 12 , further comprising solder layers having a thickness within the range from about 0.005 to 0.010 inches.
16. The bonded plate assembly of claim 12 , wherein each piece of the bonding foil is selected so that the alternating layers within the foil produce silicides, aluminides, borides, carbides, thermite reacting compounds, alloys, metallic glasses and composites upon reaction.
17. The bonded plate assembly of claim 12 , wherein the nickel plate is a substantially circular, disc-shaped plate.