Inductor and electric power supply using it
An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
1. An electronic device comprising:
a circuit board; and
a power supply circuit provided in the circuit board and configured to supply power to a semiconductor device mounted on a surface of the circuit board,
wherein the power supply circuit includes an inductor extending in a thickness direction of the circuit board perpendicular to the surface of the circuit board, the inductor comprises a magnetic body extending in the thickness direction of the circuit board and a through-hole conductor extending in the thickness direction of the circuit board, the magnetic body of the inductor has a through-hole extending in the thickness direction of the circuit board, and the through-hole conductor of the inductor is formed on an inner surface of the through-hole formed in the magnetic body.
2. The electronic device according to claim 1 , wherein the power supply circuit includes a thin-film capacitor formed in a direction parallel to the surface of the circuit board, and a power supply IC device mounted on a surface of the circuit board on an opposite side of the surface on which the semiconductor device is mounted.
3. The electronic device according to claim 1 , wherein the power supply circuit includes a thin-film capacitor formed in a direction parallel to the surface of the circuit board and a power supply IC device mounted on a surface of the circuit board on an opposite side of the surface on which the semiconductor device is mounted, and the power supply circuit and the semiconductor device are connected to each other with a conductive circuit having a distance of 1 mm or less.
4. The electronic device according to claim 1 , wherein the power supply circuit is provided in a plurality in the circuit board.
5. The electronic device according to claim 1 , wherein the circuit board has a core substrate, and the inductor is formed in the core substrate of the circuit board.
6. The electronic device according to claim 1 , wherein the magnetic body has a cylindrical shape having the through-hole.
7. The electronic device according to claim 1 , wherein the magnetic body has a cylindrical shape, the circuit board has a core substrate, and the magnetic body is embedded in the core substrate of the circuit board.
8. The electronic device according to claim 1 , wherein the through-hole conductor is extending along a longitudinal axis of the magnetic body.
9. The electronic device according to claim 1 , wherein the through-hole conductor is formed by plating.
10. The electronic device according to claim 1 , wherein the through-hole conductor is formed by copper plating.
11. The electronic device according to claim 1 , wherein the through-hole conductor is formed by plating.
12. The electronic device according to claim 1 , wherein the power supply circuit and the semiconductor device are connected to each other with a conductive circuit comprising a plurality of via-hole conductors.
13. The electronic device according to claim 1 , wherein the power supply circuit and the semiconductor device are connected to each other with a conductive circuit comprising a plurality of via-hole conductors in a distance of 1 mm or less.