Coating-type underlayer coating forming composition for lithography containing naphthalene resin derivative
To provide a coating-type underlayer coating forming composition containing a naphthalene resin derivative. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (1): wherein A is an organic group having an aromatic group, R 1 is hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the reminder is hydrogen atom, and n is the number of repeating units ranging from 2 to 7000.
1. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (1):
wherein A is an organic group having an aromatic group, R 1 is hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the remainder is hydrogen atom, and n is the number of repeating units ranging from 2 to 7000.
2. The coating-type underlayer coating forming composition for lithography according to claim 1 , further comprising a crosslinking compound.
3. The coating-type underlayer coating forming composition for lithography according to claim 2 , further comprising an acid, an acid generator, or both of them.
4. The coating-type underlayer coating forming composition for lithography according to claim 1 , further comprising an acid, an acid generator, or both of them.
5. A coating type underlayer coating for lithography obtained by coating the coating-type underlayer coating forming composition according to claim 1 on a semiconductor substrate and baking it.
6. A method for forming photoresist pattern for use in manufacture of semiconductor device, comprising coating the coating-type underlayer coating forming composition according to claim 1 on a semiconductor substrate, and baking it to form a coating-type underlayer coating.
7. A method for manufacturing semiconductor device comprising the steps of:
forming a coating-type underlayer coating from the coating-type underlayer coating forming composition according to claim 1 ;
forming a resist coating on the coating-type underlayer coating;
forming a resist pattern by exposure to light and development;
etching the coating-type underlayer coating by use of the resist pattern; and
processing the semiconductor substrate by use of the patterned coating-type underlayer coating.
8. A method for manufacturing semiconductor device comprising the steps of:
forming a coating-type underlayer coating from the coating type underlayer coating forming composition according to claim 1 ;
forming a hardmask on the coating-type underlayer coating;
forming a resist coating further thereon;
forming a resist pattern by exposure to light and development;
etching the hardmask by use of the resist pattern;
etching the coating-type underlayer coating by use of the patterned hardmask; and
processing the semiconductor substrate by use of the patterned coating-type underlayer coating.
9. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (2):
wherein A is an organic group having an aromatic group, R 1 is a hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the remainder is hydrogen atom, n is the number of repeating units ranging from 2 to 7000, and Ar 1 is a substituted or unsubstituted aromatic group.
10. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (3):
wherein X is a single bond, methylene group, C 2-10 -alkylene group, a divalent hydrocarbon group having C 2-10 ether bond, or carbonyl group, Z is a linking group of —O— or —OC(═O)—, Ar 2 is an unsubstituted aromatic ring or an aromatic ring substituted with carboxylic acid, a carboxylic acid ester group, hydroxy group, an alkyl group, an alkoxy group, sulfonic acid group, or a halogen group, R 1 is a hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the remainder is hydrogen atom and n is the number of repeating units ranging from 2 to 7000.
11. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (4):
wherein X is a single bond, methylene group, C 2-10 alkylene group, a divalent hydrocarbon group having C 2-10 ether bond, or carbonyl group, Z is a linking group of —O— or —OC(═O)—, Ar 2 is an unsubstituted aromatic ring or an aromatic ring substituted with carboxylic acid, a carboxylic acid ester group, hydroxy group, an alkyl group, an alkoxy group, sulfonic acid group, or a halogen group, Ar 1 is a substituted or unsubstituted aromatic group, Ar 2 is an unsubstituted aromatic ring or an aromatic ring substituted with carboxylic acid, a carboxylic acid ester group, hydroxy group, an alkyl group, an alkoxy group, sulfonic acid group, or a halogen group R 1 is a hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the remainder is hydrogen atom, and n is the number of repeating units ranging from 2 to 7000.
12. A coating-type underlayer coating forming composition for lithography comprising a compound of formula (5):
wherein X is a single bond, methylene group, C 2-10 alkylene group, a divalent hydrocarbon group having C 2-10 ether bond, or carbonyl group, Z is a linking group of —O— or —OC(═O)—, Ar 2 is an unsubstituted aromatic ring or an aromatic ring substituted with carboxylic acid, a carboxylic acid ester group, hydroxy group, an alkyl group, an alkoxy group, sulfonic acid group, or a halogen group, Ar 2 is an unsubstituted aromatic ring or an aromatic ring substituted with carboxylic acid, a carboxylic acid ester group, hydroxy group, an alkyl group, an alkoxy group, sulfonic acid group, or a halogen group, R 1 is a hydroxy group, an alkyl group, an alkoxy group, a halogen group, a thiol group, an amino group or an amide group, m1 is the number of A substituted on the naphthalene ring and is an integer of 1 to 6, m2 is the number of R 1 substituted on the naphthalene ring and is an integer of 0 to 5, a sum of m1 and m2 (m1+m2) is an integer of 1 to 6, in cases where the sum is an integer other than 6, the remainder is hydrogen atom and n is the number of repeating units ranging from 2 to 7000.