Methods and apparatus for multi-stage molding of integrated circuit package
Methods and apparatus for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
1. An integrated circuit device, comprising:
at least one die attached to a leadframe having lead fingers;
wirebonds making connections between the at least one die and the leadfingers;
a first mold material injected at a first pressure to prevent wire sway of the wirebonds for encapsulating the wirebonds and covering at least a portion of the at least one die and the leadfingers, wherein the first mold material is only on a die-side of the leadframe and overmolds all wirebonds connected to the at least one die;
a concentrator having a first side and a second side, wherein the first side is secured to a non die-side of the leadframe;
a magnet secured to the second side of the concentrator, and
a second mold material injected at a second pressure greater than the first pressure for overmolding the at least one die, first mold material, concentrator, and magnet.
2. The device according to claim 1 , wherein the first mold material encapsulates the at least one die on the leadframe.
3. The device according to claim 1 , wherein the first mold material has a coefficient of expansion compatible with a coefficient of expansion for a magnet.
4. The device according to claim 1 , wherein the first and second mold material are different.
5. The device according to claim 1 , wherein the at least one die includes one or more magnetic field sensors.
6. The device according to claim 5 , wherein the magnetic field sensor includes a Hall element.
7. The device according to claim 1 , wherein the wirebond includes a gold wire.