Semiconductor memory device and method for fabricating semiconductor memory device
According to an aspect of the present invention, there is provided a semiconductor memory device comprising, a first transistor and a second transistor formed on a semiconductor substrate, a memory capacitor formed above the first transistor, the memory capacitor being connected to the first transistor, a dummy memory capacitor formed above the second transistor, a wiring layer formed above the memory capacitor and the dummy memory capacitor, the wiring layer being connected to the first transistor and the memory capacitor, a first plug connecting between the second transistor and the dummy memory capacitor, and a second plug connecting between the dummy memory capacitor and the wiring layer.
1. A semiconductor memory device comprising;
a first transistor and a second transistor formed on a semiconductor substrate, both the first transistor and the second transistor being MIS transistors;
a memory capacitor formed above the first transistor, the memory capacitor being connected to the first transistor, the memory capacitor being stacked with a lower electrode, a dielectric film and an upper electrode in order, the lower electrode being connected to a source or a drain of the first transistor;
a pair of dummy memory capacitors formed above the second transistor, each dummy memory capacitor being stacked with a dummy lower electrode, a dummy dielectric film and a dummy upper electrode in order, the dummy lower electrodes in the pair being configured as a common electrode, the memory capacitor and the dummy memory capacitor being formed in a same plane above the semiconductor substrate;
a wiring layer formed above the memory capacitor and the dummy memory capacitor, the wiring layer being connected to the source or the drain of the first transistor and the upper electrode;
a first plug connecting between a source or a drain of the second transistor and the dummy lower electrode; and
a second plug connecting between the dummy lower electrode and the wiring layer, the second plug penetrating into the paired dummy upper electrodes and the paired dummy dielectric films to contact with a surface of the dummy lower electrode.
2. The semiconductor memory device according to the claim 1 , wherein
a source or a drain of the second transistor is connected to a source or a drain of the first transistor via a dummy transistor.
3. The semiconductor memory device according to the claim 1 , wherein both the dielectric film and the dummy dielectric film are ferroelectric film.
4. The semiconductor memory device according to the claim 1 , further comprising:
a first mask film on the paired dummy upper electrodes; and
a second mask film on the first mask film, sidewalls of the paired dummy dielectric films and a portion of the dummy lower electrode between the paired dummy capacitors;
wherein the second plug penetrates into the second mask film to contact with a surface of the portion of the dummy lower electrode.
5. The semiconductor memory device according to the claim 1 , wherein
a sidewall of the second plug is in contact with at least one of the sidewalls of the paired dummy upper electrodes and the paired dummy dielectric films.