IP Library Granted Patent US 7,821,613
Granted Patent B2
US 7,821,613 · App. 11/614,809 · Granted Oct 26, 2010

Display device and manufacturing method thereof

Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 7,821,613
App. No.
11/614,809
Granted
Oct 26, 2010
Kind
B2
Abstract

In a semi-transmission liquid crystal display device, two resist masks are required to form a reflective electrode and a transparent electrode; therefore, cost is high. A transparent electrode and a reflective electrode which function as a pixel electrode are stacked. A resist pattern which includes a region having a thick film thickness and a region having a thinner film thickness than the aforementioned region is formed over the reflective electrode by using a light exposure mask which includes a semi-transmission portion. The reflective electrode and the transparent electrode are formed by using the resist pattern. Therefore, the reflective electrode and the transparent electrode can be formed by using one resist mask.

Claims (56)

1. A manufacturing method of a display device, comprising the steps of:

forming a transistor over a substrate;

forming an insulating film over the transistor;

forming a transparent conductive film over the insulating film;

forming a reflective conductive film over the transparent conductive film;

forming a resist pattern which comprises a region having a thick film thickness and a region having a thinner film thickness than the region over the reflective conductive film by using a light exposure mask which comprises a semi-transmission portion;

forming a transparent electrode and a reflective electrode by etching the transparent conductive film and the reflective conductive film using the resist pattern;

providing a second substrate on which an opposite electrode is formed; and

providing a liquid crystal layer between the opposite electrode and a pixel electrode including the transparent electrode and the reflective electrode,

wherein a film for adjusting a cell gap is provided on the opposite electrode.

2. The manufacturing method of the display device according to claim 1 , wherein the transistor includes a compound semiconductor.

3. The manufacturing method of the display device according to claim 2 , wherein the transistor compound semiconductor is InGaZnO.

4. The manufacturing method of the display device according to claim 3 , wherein InGaZnO is a-InGaZnO.

5. A manufacturing method of a display device, comprising the steps of:

forming a transistor over a substrate;

forming an insulating film over the transistor;

forming a transparent conductive film over the insulating film;

forming a reflective conductive film over the transparent conductive film;

forming a resist pattern which comprises a region having a thick film thickness and a region having a thinner film thickness than the region over the reflective conductive film by using a light exposure mask which comprises a semi-transmission portion;

etching the reflective conductive film and the transparent conductive film by using the resist pattern;

removing a part of the resist pattern;

etching the reflective conductive film by using the resist pattern after removing the part of the resist pattern;

providing a second substrate on which an opposite electrode is formed; and

providing a liquid crystal layer between the opposite electrode and a pixel electrode including the transparent conductive film and the reflective conductive film,

wherein a film for adjusting a cell gap is provided on the opposite electrode.

6. The manufacturing method of the display device according to claim 5 , wherein the transistor includes a compound semiconductor.

7. The manufacturing method of the display device according to claim 6 , wherein the compound semiconductor is InGaZnO.

8. The manufacturing method of the display device according to claim 7 , wherein InGaZnO is a-InGaZnO.

9. A manufacturing method of a display device, comprising the steps of:

forming a transistor over a first substrate;

forming an insulating film over the transistor;

forming a transparent conductive film over the insulating film;

forming a reflective conductive film over the transparent conductive film;

forming a resist pattern which comprises a region having a thick film thickness and a region having a thinner film thickness than the region over the reflective conductive film by using a light exposure mask which comprises a semi-transmission portion; and

forming a transparent electrode and a reflective electrode by etching the transparent conductive film and the reflective conductive film using the resist pattern;

providing a second substrate on which an opposite electrode is formed; and

providing a liquid crystal layer between the opposite electrode and a pixel electrode including the transparent electrode and the reflective electrode,

wherein a film for adjusting a cell gap is provided between the opposite electrode and the second substrate.

10. The manufacturing method of the display device according to claim 9 , wherein the transistor includes a compound semiconductor.

11. The manufacturing method of the display device according to claim 10 , wherein the compound semiconductor is InGaZnO.

12. The manufacturing method of the display device according to claim 11 , wherein InGaZnO is a-InGaZnO.

13. A manufacturing method of a display device, comprising the steps of:

forming a transistor over a first substrate;

forming an insulating film over the transistor;

forming a transparent conductive film over the insulating film;

forming a reflective conductive film over the transparent conductive film;

forming a resist pattern which comprises a region having a thick film thickness and a region having a thinner film thickness than the region over the reflective conductive film by using a light exposure mask which comprises a semi-transmission portion;

etching the reflective conductive film and the transparent conductive film by using the resist pattern;

removing a part of the resist pattern; and

etching the reflective conductive film by using the resist pattern after removing the part of the resist pattern; and

providing a second substrate on which an opposite electrode is formed; and

providing a liquid crystal layer between the opposite electrode and a pixel electrode including the transparent conductive film and the reflective conductive film

wherein a film for adjusting a cell gap is provided between the opposite electrode and the second substrate.

14. The manufacturing method of the display device according to claim 13 , wherein the transistor includes a compound semiconductor.

15. The manufacturing method of the display device according to claim 14 , wherein the compound semiconductor is InGaZnO.

16. The manufacturing method of the display device according to claim 15 , wherein InGaZnO is a-InGaZnO.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2006
From: KIMURA, HAJIME
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 018673/0621 →
Priority Claims (1)
JP 2005-378778 · Dec 28, 2005 · national
Continuity (1)
Related Publication 20070146592A1 · Jun 28, 2007