Inkjet printed leadframe
Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.
1. A method of manufacturing an integrated circuit device, comprising:
designing a layout for an electrical interconnect pattern adapted to connect external components with said integrated circuit device;
communicating said layout for said electrical interconnect pattern to an inkjet printer;
positioning a thin substrate proximate to a printing component of said inkjet printer;
printing a metallic nanoink from said inkjet printer onto said thin substrate in the form of said layout for said electrical interconnect pattern; and
curing said metallic nanoink such that a substantially metallic residual remains on said thin substrate, wherein said electrical interconnect pattern is part of a panel containing multiple and separate arrays covered by a molded cap and having multiple packages each, wherein said molded cap is of substantially uniform thickness over each separate array of multiple packages, and wherein said molded cap extends between each separate array of multiple packages.
2. The method of claim 1 , wherein said electrical interconnect pattern comprises a leadframe type layout.
3. The method of claim 2 , wherein said electrical interconnect pattern comprises a leadless leadframe type layout.
4. The method of claim 1 , wherein said electrical interconnect pattern comprises a substantially consistent thickness of about 75 microns or less.
5. The method of claim 4 , wherein said electrical interconnect pattern comprises a substantially consistent thickness of about 50 microns or less.
6. The method of claim 5 , wherein said electrical interconnect pattern comprises a substantially consistent thickness of about 10 microns or less.
7. The method of claim 1 , wherein said thin substrate is moved past said printing component using a reel to reel process.
8. The method of claim 1 , wherein said metallic nanoink comprises a fluid having silver or copper particles from about 5 to 100 nanometers in diameter.
9. The method of claim 1 , wherein said metallic nanoink comprises a fluid having a metallic percentage ranging from about 20 to 50 percent.
10. The method of claim 1 , further including the steps of:
positioning said integrated circuit device against the metallic nanoink patterned side of said thin substrate;
providing a molded cap that encapsulates said integrated circuit device; and
removing said thin substrate from the integrated circuit device such that said metallic nanoink pattern remains on the integrated circuit device.
11. A method of manufacturing an electrical interconnect pattern for one or more integrated circuit devices, comprising:
designing a layout for said electrical interconnect pattern;
communicating said layout for said electrical interconnect pattern to an inkjet printer;
moving a thin substrate adapted for high temperature processing past a printing component of said inkjet printer;
dispensing a metallic nanoink from said inkjet printer onto said thin substrate in said layout for said electrical interconnect pattern as the thin substrate moves past said printing component; and
curing said metallic nanoink such that a liquid component is driven therefrom and such that said substantially metallic residual electrical interconnect pattern remains on said thin substrate, wherein said electrical interconnect pattern is part of a panel containing multiple and separate arrays covered by a molded cap and having multiple packages each, wherein said molded cap is of substantially uniform thickness over each separate array of multiple packages, and wherein said molded cap extends between each separate array of multiple packages.
12. The method of claim 11 , wherein said electrical interconnect pattern comprises a leadframe having a substantially consistent thickness of about 50 microns or less.
13. The method of claim 11 , wherein said thin substrate is moved past said printing component using a reel to reel process.