Arranging and/or supporting an image pickup device in an image pickup apparatus
An image pickup apparatus includes: an image pickup device comprising a bare chip and having an image pickup area and a mount area on the same face; an electric board having the image pickup device mounted thereon; and a support having an opening. The support is disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening. The opening is supplied with an adhesive to fix the support to the image pickup device. Thus, the image pickup apparatus to which the support can be fixed with a sufficient adhesive strength can be provided.
1. An image pickup apparatus comprising:
an optical element permitting image pickup light to pass through;
an electric board having connection patterns on one face, and having the optical element fixed on the other face;
an image pickup device ( 1 ) being a bare chip, ( 2 ) being plate-shaped, ( 3 ) having an uncovered outer periphery, and ( 4 ) having an image pickup area and a mount area on the same face, the image pickup device being electrically connected to the connection patterns in the one face of the electric board such that the image pickup area is opposed to the optical element;
a support for supporting the image pickup device, wherein the support is plate-shaped and has an opening which is supplied with an adhesive to fix the image pickup device to the support, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip, and
wherein the electric board is a flexible printed circuit board.
2. The apparatus according to claim 1 , wherein the support has a plurality of openings.
3. The apparatus according to claim 1 , wherein the image pickup apparatus is a single lens reflex camera.
4. The image pickup apparatus of claim 1 wherein the adhesive supplied to the opening of the support to fix the image pickup device to the support has a concave outer surface.
5. An image pickup apparatus comprising:
an image pickup device ( 1 ) being a bare chip, ( 2 ) being plate-shaped, ( 3 ) having an uncovered outer periphery, and ( 4 ) having an image pickup area and a mount area on the same face;
an electric board on which the image pickup device is mounted, wherein the electric board is a flexible printed circuit board; and
a support having an opening, the support being plate-shaped and disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening, the opening being supplied with an adhesive to fix the support to the image pickup device, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip.
6. The apparatus according to claim 5 , further comprising:
a heat releasing member is plated-shaped and arranged between the support and the image pickup device.
7. The apparatus according to claim 5 , wherein the support acts as a heat releasing member.
8. The apparatus according to claim 5 , wherein the electric board has an opening that surrounds the entire periphery of the image pickup area of the image pickup device so that image pickup light reaches the image pickup area through the opening.
9. The apparatus according to claim 5 , further comprising:
a photographic-lens support from which a photographic lens is detachable, wherein
the support is fixed to the photographic-lens support.
10. The apparatus according to claim 5 , wherein the support has a plurality of openings.
11. The apparatus according to claim 5 , further comprising:
an optical element that is transparent to light, the optical element being arranged on a rear face of the electric board on which the image pickup device is mounted such that the optical element is opposed to the image pickup area.
12. The apparatus according to claim 5 , wherein the image pickup apparatus includes a single lens reflex camera.
13. The image pickup apparatus of claim 5 wherein the adhesive applied to the opening of the support to fix the support to the image pickup device has a concave outer surface.
14. An image pickup unit comprising:
an optical element permitting image pickup light to pass through;
an electric board having connection patterns on one face, and having the optical element fixed on the other face;
an image pickup device comprising a bare chip, having an uncovered outer periphery and having an image pickup area and a mount area on the same face, the image pickup device being electrically connected to the connection patterns in the one face of the electric board such that the image pickup area is opposed to the optical element;
a support for supporting the image pickup device; and
a heat releasing member which is plate-shaped and arranged between the support and the image pickup device, wherein the support has an opening which is supplied with an adhesive to fix the heat releasing member to the support, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip, wherein an adhesive is applied between the heat releasing member and the image pickup device, and wherein the electric board is a flexible printed circuit board.
15. The image pickup unit of claim 14 wherein the adhesive applied to the opening of the support to fix the heat releasing member to the support has a concave outer surface.
16. An image pickup unit comprising:
an image pickup device ( 1 ) being a bare chip, ( 2 ) being plate-shaped, ( 3 ) having an uncovered outer periphery, and ( 4 ) having an image pickup area and a mount area on the same face;
an electric board having the image pickup device mounted thereon; and
a support having an opening, the support being plate-shaped and disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening, the opening being supplied with an adhesive to fix the support to the image pickup device, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip.
17. The unit according to claim 16 , further comprising:
a heat releasing member which is plate-shaped and arranged between the support and the image pickup device.
18. The unit according to claim 16 , wherein the support acts as a heat releasing member.
19. The unit according to claim 16 , wherein the electric board has an opening that surrounds the entire periphery of the image pickup area of the image pickup device so that image pickup light reaches the image pickup area through the opening.
20. The unit according to claim 16 , wherein the electric board is a flexible printed circuit board.
21. The unit according to claim 16 , further comprising:
an optical element that is transparent to light, the optical element being arranged on a rear face of the electric board on which the image pickup device is mounted such that the optical element is opposed to the image pickup area.
22. The image pickup unit of claim 16 wherein the adhesive applied to the opening of the support to fix the support to the image pickup device has a concave outer surface.
23. The unit according to claim 19 , wherein the support has a plurality of openings.
24. An image pickup apparatus comprising:
an image pickup device being a bare chip having an uncovered outer periphery and having an image pickup area and a mount area on the same face;
an electric board on which the image pickup device is mounted;
a support having an opening; and
a heat releasing member arranged between the support and the rear face of the mount surface of the image pickup device, wherein the support is disposed on the heat releasing member such that a rear face of the heat releasing member is opposed to and exposed through the opening, the opening being supplied with an adhesive to fix the support to the heat releasing member, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip, wherein the adhesive covers the opening such that the rear face of the heat releasing member is entirely covered with the adhesive in an area exposed to the opening.
25. The image pickup apparatus of claim 24 wherein the image pickup device and the heat releasing member are plate-shaped.
26. The image pickup apparatus of claim 24 wherein the adhesive supplied to the opening of the heat releasing member to fix the support to the heat releasing member has a concave outer surface.
27. An image pickup unit comprising:
an image pickup device ( 1 ) being a bare chip, ( 2 ) having an uncovered outer periphery and ( 3 ) having an image pickup area and a mount area on the same face;
an electric board having the image pickup device mounted thereon; and
a support having an opening, the support being disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening, the opening being supplied with an adhesive to fix the support to the image pickup device, the adhesive being supplied only in the opening of the support, wherein an area of the opening is smaller than the area of the chip, wherein the adhesive covers the opening such that the rear face of the mount surface of the image pickup device is entirely covered with the adhesive in an area exposed to the opening.
28. The image pickup unit of claim 27 wherein the image pickup device and the support are plate-shaped.
29. The image pickup unit of claim 27 wherein the adhesive supplied to the opening of the support to fix the support to the image pickup device has a concave outer surface.