Semiconductor device and manufacturing method thereof
View Patent ↗It is an object of the invention that, in semiconductor device, in order to promote the tendency of miniaturization of each display pixel pitch, which will be resulted in with the tendency toward the higher precision (increase of pixel number) and further miniaturizations, a plurality of elements is formed within a limited area and the area occupied by the elements is compacted so as to be integrated. A plurality of semiconductor layers 13, 15 is formed on different layers with insulating film 14 sandwiched therebetween. After carrying out crystallization by means of laser beam, on each semiconductor layer (semiconductor layers 16, 17 having crystal structure respectively), an N-channel type TFT of inversed stagger structure and a P-channel type TFT 30 of top gate structure are formed respectively and integrated so that the size of CMOS circuit is miniaturized.
1. A manufacturing method of a semiconductor device, comprising:
forming a first semiconductor film over a substrate,
forming a first insulating film over the first semiconductor film,
forming a second semiconductor film over the first insulating film,
irradiating a laser beam to the first semiconductor film having amorphous structure and the second semiconductor film having amorphous structure to form a first semiconductor film having crystal structure and a second semiconductor film having crystal structure simultaneously, and
forming a second insulating film over the second semiconductor film,
wherein crystallinity of the first semiconductor film is different from that of the second semiconductor film, and
wherein the substrate is a glass substrate, a quartz substrate, a ceramic substrate, or a plastic substrate.
2. A method according to claim 1 , wherein the laser beam is a light having a wavelength range of 400 nm-800 nm.
3. A method according to claim 1 , wherein the laser beam is light output from a continuous oscillation type solid-state laser.
4. A method according to claim 1 , wherein in the irradiation of the laser beam, a part of the laser beam passes through the second semiconductor film having amorphous structure, and further passes through the first insulating film and is absorbed by the first semiconductor film having amorphous structure.
5. A method according to claim 1 , further comprising:
forming a gate electrode over the second insulating film,
adding an impurity element for imparting N-type or P-type to the first semiconductor film having crystal structure using the gate electrode as a mask.