IP Library › Granted Patent US 7,847,293
Granted Patent B2
US 7,847,293 · App. 11/670,332 · Granted Dec 7, 2010

Growth of reduced dislocation density non-polar gallium nitride

Assignees: The Regents of the University of California; Japan Science and Technology Agency
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,847,293
App. No.
11/670,332
Granted
Dec 7, 2010
Kind
B2
Abstract

Lateral epitaxial overgrowth (LEO) of non-polar gallium nitride (GaN) films results in significantly reduced defect density.

Claims (13)

1. A method of performing a lateral epitaxial overgrowth of a planar and non-polar gallium nitride (GaN) film, comprising:

(a) patterning a mask deposited on a substrate; and

(b) performing a lateral epitaxial overgrowth of the planar and non-polar GaN film off the substrate, wherein the planar and non-polar GaN film nucleates only on portions of the substrate not covered by the patterned mask, the planar and non-polar GaN film grows vertically through openings in the patterned mask, and the planar and non-polar GaN film then spreads laterally above the patterned mask and across the substrate's surface resulting in a top surface that is planar and non-polar GaN.

2. The method of claim 1 , wherein the planar and non-polar GaN film is a coalesced planar and non-polar GaN film.

3. The method of claim 1 , wherein the planar and non-polar GaN film is an uncoalesced planar and non-polar GaN film.

4. A device manufactured using the method of claim 1 .

5. A lateral epitaxial overgrowth of a planar and non-polar gallium nitride (GaN) film off a substrate, wherein the lateral epitaxial overgrowth is created using a process comprising:

(a) patterning a dielectric mask deposited on a substrate; and

(b) performing a lateral epitaxial overgrowth of the planar and non-polar GaN film off the substrate, wherein the planar and non-polar GaN film nucleates only on portions of the substrate exposed by the patterned dielectric mask, the planar and non-polar GaN film grows vertically through openings in the patterned dielectric mask, and the planar and non-polar GaN film then spreads laterally above the patterned dielectric mask and across the substrate's surface resulting in a top surface that is planar and non-polar GaN.

6. The process of claim 5 , wherein the planar and non-polar GaN film is a coalesced planar and non-polar GaN film.

7. The process of claim 5 , wherein the planar and non-polar GaN film is an uncoalesced planar and non-polar GaN film.

8. A device including a lateral epitaxial overgrowth of a planar and non-polar gallium nitride (GaN) film having a top surface that is planar and non-polar GaN.

9. The device of claim 8 , wherein the device is light-emitting diode, a laser diode or a transistor.

Continuity (4)
Continuation 1053764400
Provisional Application 6043384300 · Dec 16, 2002
Provisional Application 6043384400 · Dec 16, 2002
Related Publication 20070126023A1 · Jun 7, 2007