Integrated high performance package systems for mm-wave array applications
Embodiments of integrated high performance package systems for millimeter-wave array applications are described herein. Other embodiments may be described and claimed.
1. A millimeter-wave (mm-wave) communications system, comprising:
an integrated circuit;
a mm-wave antenna configured to communicate using mm-wave signals;
a multilayer package comprising a plurality of package substrates for mm-wave routing and shielding;
a shielded transmission line embedded in the multilayer package to connect the integrated circuit to the mm-wave antenna; and
a plurality of integrated circuit leads configured to transmit low-frequency and direct current signals, wherein the integrated circuit leads are electromagnetically isolated from the mm-wave signals.
2. The mm-wave communications system of claim 1 , further including a base substrate wherein intermediate frequency signals are supplied through the base substrate to the mm-wave communications system.
3. The mm-wave communications system of claim 2 , wherein the intermediate frequency signals are less than 2 gigahertz (GHz).
4. The mm-wave communications system of claim 2 , wherein the base substrate is selected from the group consisting of bismaleimide-triazine (BT), Ajinomoto Build-up Film (ABF), and Flame Retardant 4 epoxy (FR4).
5. The mm-wave communications system of claim 2 , wherein the intermediate frequency signals are substantially between 4 GHz and 16 GHz.
6. The mm-wave communications system of claim 1 , wherein the package substrates are selected from the group consisting of a laminate, ceramic, semi-insulating (SI) -silicon, low-loss-organic, a liquid crystal polymer (LCP), and Rogers RO-series materials.
7. The mm-wave communications system of claim 1 , wherein the integrated circuit is embedded between a top package substrate and a bottom package substrate.
8. A system for 60 GHz band wireless communication, comprising:
an integrated circuit to communicate in the 60 GHz band through a plurality of antennas using a first transmission line and a second transmission line, wherein a packaging substrate substantially isolates the first transmission line from an electromagnetic field of the second transmission line.
9. The system of claim 8 , further including a base substrate wherein intermediate frequency signals are supplied through the base substrate to the system.
10. The system of claim 9 , wherein the intermediate frequency signals are less than 2 GHz.
11. The system of claim 9 , wherein the base substrate is selected from the group consisting of bismaleimide-triazine (BT), Ajinomoto Build-up Film (ABF), and Flame Retardant 4 epoxy (FR4).
12. The system of claim 9 , wherein the intermediate frequency signals are substantially between 2 GHz and 16 GHz.
13. The system of claim 8 , wherein the packaging substrate is selected from the group consisting of a ceramic, a laminate, semi-insulating (SI) -silicon, low-loss-organics, a liquid crystal polymer (LCP), and Rogers RO-series materials.
14. The system of claim 8 , wherein the integrated circuit is embedded between a top substrate and a bottom substrate.
15. A wireless communications device, comprising:
a host processor;
a flash memory device;
a random access memory; and
a mm-wave communications system comprising an integrated circuit configured to communicate in a 60 GHz band through a plurality of antennas using a first transmission line and a second transmission line, wherein a packaging substrate substantially isolates the first transmission line from an electromagnetic field of the second transmission line.
16. The wireless communications device of claim 15 , further including a base substrate wherein intermediate frequency signals are supplied through the base substrate to the mm-wave communications system.
17. The wireless communications device of claim 16 , wherein the intermediate frequency signals are less than 2 GHz.
18. The wireless communications device of claim 16 , wherein the base substrate is selected from the group consisting of bismaleimide-triazine (BT), Ajinomoto Build-up Film (ABF), and Flame Retardant 4 epoxy (FR4).
19. The wireless communications device of claim 16 , wherein the intermediate frequency signals are substantially between 2 GHz and 16 GHz.
20. The wireless communications device of claim 15 , wherein the packaging substrate are selected from the group consisting of a laminate, ceramic, semi-insulating (SI) -silicon, low-loss-organic, a liquid crystal polymer (LCP), and Rogers RO-series materials.