Method of measuring dimension of pattern and method of forming pattern
A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to a center of the second pattern, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measurement step, and a calculation step of calculating a width of the second pattern from W B =2D A +W D +D C , where W B is the calculated width of the second pattern, D C is a design value of a distance between the centers of the pair of first dummy patterns, D A is a measured spaced distance of the one of the first dummy patterns from the edge of the second pattern, and W D is a measured width of the one of the first dummy patterns.
1. A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of said first pattern and formed in a symmetrical appearance with respect to a center of the second pattern, said second pattern having edges opposed to each other defining the second width, said method comprising:
a step of forming a pair of first dummy patterns each having a narrow width, said pair of first dummy patterns being spaced from said edges of said second pattern respectively by a distance approximate to the first width of said first pattern;
a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of said first dummy patterns from the edge of said second pattern and a width of said one of said first dummy patterns within the same field of view of said dimension measuring device;
a second measurement step of measuring, using said dimension measuring device, a width of said first pattern under the same measurement condition as that of the first measurement step; and
a calculation step of calculating a width of said second pattern from W B =2D A +W D +D C , where W B is the calculated width of said second pattern, D C is a design value of a distance between the centers of said pair of first dummy patterns, D A is a measured spaced distance of said one of said first dummy patterns from the edge of said second pattern, and W D is a measured width of said one of said first dummy patterns.
2. The method as claimed in claim 1 , wherein said method further comprises a step of forming a pair of second dummy patterns each having a narrow width, said pair of second dummy patterns being spaced from edges opposed to each other of the respective first dummy patterns by said spaced distance, respectively.
3. The method as claimed in claim 2 , wherein said method further comprises a step of removing said pair of first dummy patterns and said pair of second dummy patterns after said first and second measurement steps.
4. The method as claimed in claim 1 , wherein said dimension measuring device is a scanning electron microscope.
5. The method as claimed in claim 4 , wherein said first measurement step comprises measuring a spaced distance of one of said first dummy patterns from the edge of said second pattern and a width of said one of said first dummy patterns within the same field of view of said scanning electron microscope, said field of view being determined so that said scanning electron microscope can accurately measure.
6. The method as claimed in claim 1 , wherein said distance between each of said pair of first dummy patterns and the respective edges of said second pattern is equal to the first width of said first pattern.
7. The method as claimed in claim 1 , wherein said method further comprises a step of removing said pair of first dummy patterns after said first and second measurement steps.
8. The method as claimed in claim 1 , wherein said first patterns and said second pattern are mask pattern formed on a photo-mask.
9. The method as claimed in claim 1 , wherein said first patterns and said second pattern are resist pattern formed on a wafer.
10. A method of forming a pattern including a process of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of said first pattern and formed in a symmetrical appearance with respect to a center of the second pattern, said second pattern having edges opposed to each other defining the second width, and a process of correcting defect of the pattern depending upon the measured dimension, said process of measuring dimension comprising:
a step of forming a pair of first dummy patterns each having a narrow width, said pair of first dummy patterns being spaced from said edges of said second pattern respectively by a distance approximate to the first width of said first pattern;
a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of said first dummy patterns from the edge of said second pattern and a width of said one of said first dummy patterns within the same field of view of said dimension measuring device;
a second measurement step of measuring, using said dimension measuring device, a width of said first pattern under the same measurement condition as that of the first measurement step; and
a calculation step of calculating a width of said second pattern from W B =2D A +W D +D C , where W B is the calculated width of said second pattern, D C is a design value of a distance between the centers of said pair of first dummy patterns, D A is a measured spaced distance of said one of said first dummy patterns from the edge of said second pattern, and W D is a measured width of said one of said first dummy patterns.
11. The method as claimed in claim 10 , wherein said process of measuring dimension further comprises a step of forming a pair of second dummy patterns each having a narrow width, said pair of second dummy patterns being spaced from edges opposed to each other of the respective first dummy patterns by said spaced distance, respectively.
12. The method as claimed in claim 11 , wherein said process of measuring dimension further comprises a step of removing said pair of first dummy patterns and said pair of second dummy patterns after said first and second measurement steps.
13. The method as claimed in claim 10 , wherein said dimension measuring device is a scanning electron microscope.
14. The method as claimed in claim 13 , wherein said first measurement step comprises measuring a spaced distance of one of said first dummy patterns from the edge of said second pattern and a width of said one of said first dummy patterns within the same field of view of said scanning electron microscope, said field of view being determined so that said scanning electron microscope can accurately measure.
15. The method as claimed in claim 10 , wherein said distance between each of said pair of first dummy patterns and the respective edges of said second pattern is equal to the first width of said first pattern.
16. The method as claimed in claim 10 , wherein said process of measuring dimension further comprises a step of removing said pair of first dummy patterns after said first and second measurement steps.
17. The method as claimed in claim 10 , wherein said first patterns and said second pattern are mask pattern formed on a photo-mask.
18. The method as claimed in claim 10 , wherein said first patterns and said second pattern are resist pattern formed on a wafer.