Stacking semiconductor device and production method thereof
In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.
1. A method of producing a stacked semiconductor device having a first-layer semiconductor device and a second-layer semiconductor device formed by being staked on each other, comprising the steps of:
disposing the second-layer semiconductor device on the first-layer semiconductor device which is warped
providing, between a first-layer semiconductor device and a second-layer semiconductor device, solder and a thermosetting resin for bonding the first-layer semiconductor device and the second-layer semiconductor device;
heating the first-layer semiconductor device and the second-layer semiconductor device to a first temperature at which the first-layer semiconductor device has a flat shape to cure the thermosetting resin;
heating the first-layer semiconductor device and the second-layer semiconductor device to a second temperature which is higher than the first temperature to melt the solder; and
cooling the first-layer semiconductor device and the second-layer semiconductor device to solidify the solder.
2. The method according to claim 1 , wherein the curing temperature of the thermosetting resin is 150 to 180° C. and the heating time is 30 to 90 seconds.