IP Library Granted Patent US 7,867,316
Granted Patent B2
US 7,867,316 · App. 12/081,263 · Granted Jan 11, 2011

Method of manufacturing metal nanoparticles

Assignee: Samsung Electro-Mechanics Co., Ltd.
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Quick Facts
Patent No.
US 7,867,316
App. No.
12/081,263
Granted
Jan 11, 2011
Kind
B2
Abstract

The present invention relates to a method for manufacturing metal nanoparticles including: preparing a first solution including a metal precursor and a non-polar solvent; preparing a second solution with adding a capping molecule presented by the following Formula 1 into the first solution; and stirring the second solution with applying heat, wherein R1 and R2 are independently —COOH, —NH 2 or —CH 3 but R1 and R2 cannot be —COOH at the same time, and x and y is independently an integer from 3 to 20 respectively and x+y is 20 to 40.

Claims (16)

1. A method of manufacturing metal nanoparticles comprising:

preparing a first solution including a metal precursor and a non-polar solvent;

preparing a second solution by adding a capping molecule represented by the following Formula 1 into the first solution; and

stirring the second solution with applying heat,

wherein R1 and R2 are independently —COON, —NH 2 or —CH 3 but R1 and R2 cannot be —COOH at the same time, and x and y is independently an integer from 3 to 20 respectively and x+y is 20 to 40.

2. The method of claim 1 , wherein the capping molecule is at least one selected from the group consisting of CH 3 —(CH 2 ) 17 —CO—NH—(CH 2 ) 9 —CH 3 and NH 2 —(CH 2 ) 17 —CO—NH—(CH 2 ) 9 —CH 3 .

3. The method of claim 1 , wherein the first solution further comprises an amine compound.

4. The method of claim 3 , wherein the amine compound has a structure of C x H 2x+1 NH 2 and x is an integer from 2 to 20.

5. The method of claim 4 , wherein the amine compound is at least one selected from the group consisting of butylamine, propylamine, octylamine, decylamine, dodecylamine, hexadecylamine and oleylamine.

6. The method of claim 3 , wherein the stirring the second solution with applying heat is performed at 60 to 110° C.

7. The method of claim 1 or claim 3 , wherein a reducing agent is further added into the second solution.

8. The method of claim 7 , wherein the reducing agent is at least one selected from the group consisting of NaBH 4 , LiBH 4 , KBH 4 , N 2 H 4 , PhHNNH 2 , NH 3 —BH 3 , (CH 3 ) 3 N—BH 3 , NaH 2 PO 2 , formic acid, and tetrabutylammonium borohydride.

9. The method of claim 1 , wherein the metal precursor is a precursor of at least one metal selected from the group consisting of copper, silver, nickel, iron, gold, platinum, palladium, zinc, titanium and their alloys.

10. The method of claim 9 , wherein the metal precursor is at least one selected from the group consisting of AgCl, AgNO 3 , AgBF 4 , AgPF 6 , Ag 2 O, CH 3 COOAg, AgCF 3 SO 3 , AgClO 4 , CuCl 2 , Cu(NO 3 ) 2 , CuSO 4 , (CHCOO) 2 Cu and copper acetyloacetate(Cu(acac) 2 ).

11. The method of claim 1 , wherein the non-polar solvent is at least one selected from the group consisting of toluene, hexane, diphenylether, octylether, dimethylformaldehide, tetrahydrofuran, 1-octadecene and tetradecane.

12. The method of claim 1 , wherein the stirring the second solution with applying heat is performed at 60 to 120° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2008
From: JUN, BYUNG-HO; KIM, DONG-HOON; LEE, KWI-JONG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 020854/0621 →
Priority Claims (1)
KR 10-2007-0114531 · Nov 9, 2007 · national
Continuity (1)
Related Publication 20090120238A1 · May 14, 2009