Heat dissipation device of notebook computer
A heat dissipation device is provided for dissipating heat from a heat source inside a notebook computer, and includes a hood, a bottom board, a thermal insulation layer, and at least one fan. The hood and the bottom board together define a heat dissipation channel. The bottom board integrally forms a plurality of fins and pegs. The bottom board is set above the heat source. The fan is set above the bottom board to efficiently expel heat from the inside to the outside. With the plurality of fins and pegs, the heat dissipation surface area of the bottom board and the heat source is increased and the overall heat dissipation performance is enhanced.
1. A heat dissipation device, which is applicable to dissipate heat from a heat source inside a notebook computer, comprising:
a hood forming an internal receiving space;
a bottom board, which arranges a plurality of pegs and a plurality of fins beside the plurality of pegs at locations corresponding the heat source, the bottom board being positioned above the heat source and being mounted to and covering an open bottom of the hood so that the hood and the bottom board together defines a heat dissipation channel;
a thermal insulation layer set on a top face of the bottom board forming apertures corresponding to the plurality of fins and the plurality of pegs; and
at least one fan set above the bottom board and is located close to the heat dissipation channel.
2. The heat dissipation device according to claim 1 , wherein the hood is an elongate hood and the bottom board is shaped corresponding thereto.
3. The heat dissipation device according to claim 1 , wherein the hood is a crooked hood and the bottom board is crook-shaped corresponding thereto.
4. The heat dissipation device according to claim 1 , wherein the hood and the bottom board are respectively an aluminum hood and an aluminum bottom board.
5. The heat dissipation device according to claim 1 , wherein the plurality of fins and the plurality of pegs are integrally formed with the bottom board.
6. The heat dissipation device according to claim 1 , wherein the fins comprise long fins arranged on opposite side portions of the bottom board and short fins arranged between the plurality of pegs.
7. The heat dissipation device according to claim 1 , wherein the fan is set above the plurality of pegs.
8. The heat dissipation device according to claim 1 , wherein the fan is set outside the plurality of pegs and exposed outside the heat dissipation channel.
9. The heat dissipation device according to claim 1 , wherein two fans are respectively set at opposite ends of the heat dissipation channel.
10. The heat dissipation device according to claim 1 , wherein the plurality of fins comprises fins arranged at opposite side portions of the bottom board and fins arranged at a central portion of the bottom board, and wherein the fins arranged at the opposite side portions of the bottom board are of a height greater than that of the fins arranged on the central portion of the bottom board.