IP Library › Granted Patent US 7,872,532
Granted Patent B2
US 7,872,532 · App. 12/420,955 · Granted Jan 18, 2011

High-frequency power amplifier and communication device

Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 7,872,532
App. No.
12/420,955
Granted
Jan 18, 2011
Kind
B2
Abstract

It is an object of the present invention to provide a high-frequency power amplifier capable of improving the linearity at the time of high output by preventing decrease in power of bias supply transistor. The high-frequency power amplifier is a high-frequency power amplifier including high-frequency power amplifier transistors and connected in multiple stages and bias supply transistors and each of which supplies bias current to a base of a corresponding one of said high-frequency power amplifier transistors, and each of which is connected to a common power supply terminal which is further connected to a collector of the high-frequency power amplifier transistor at a first stage among said high-frequency power amplifier transistors, and a passive element connected between the common supply terminal and a collector of the corresponding one of said bias supply transistors connected to the high-frequency power amplifier transistor at the first stage.

Claims (36)

1. A high-frequency power amplifier, comprising:

high-frequency power amplifier transistors connected in multiple stages; and

bias supply transistors, each of which supplies a bias current to a base of a corresponding one of said high-frequency power amplifier transistors, and each of which is connected to a common power supply terminal which is further connected to a collector of the high-frequency power amplifier transistor at a first stage among said high-frequency power amplifier transistors, and

a passive element connected between the common supply terminal and a collector of the corresponding one of said bias supply transistors connected to the high-frequency power amplifier transistor at the first stage.

2. The high-frequency power amplifier according to claim 1 , further comprising

a diode connected between a base of a corresponding one of said bias supply transistors and a ground.

3. The high-frequency power amplifier according to claim 1 , further comprising:

a first temperature compensation transistor having:

a collector connected to a collector of a corresponding one of said bias supply transistors;

an emitter grounded via a first resistor; and

a base connected to a base of the corresponding one of said bias supply transistors; and

a second temperature compensation transistor having:

a collector connected to the base of the corresponding one of said bias supply transistors;

a base connected to the emitter of said first temperature compensation transistor; and

an emitter which is grounded.

4. The high-frequency power amplifier according to claim 1 ,

wherein the common power supply terminal is connected to collectors of transistors in the multiple stages, and

said high-frequency power amplifier further comprises

a passive element connected between the common power supply terminal and a collector of one of said bias supply transistors among the transistors in the multiple stages.

5. The high-frequency power amplifier according to claim 1 ,

wherein said passive element is a resistor.

6. The high-frequency power amplifier according to claim 5 ,

wherein a resistance value of the resistor ranges from several hundred ohms to several thousand ohms.

7. The high-frequency power amplifier according to claim 1 ,

wherein said passive element is an inductor.

8. The high-frequency power amplifier according to claim 7 ,

wherein an inductance value of the inductor is several nanohenries.

9. The high-frequency power amplifier according to claim 1 ,

wherein said passive element is a serial connection of a resistor and an inductor.

10. The high-frequency power amplifier according to claim 9 ,

wherein the resistance value of the resistor ranges from several hundred ohms to several thousand ohms, and the inductance value of the inductor is several nanohenries.

11. A communication device, comprising:

a high-frequency power amplifier having:

high-frequency power amplifier transistors connected in multiple stages; and

bias supply transistors, each of which supplies a bias current to a base of a corresponding one of said high-frequency power amplifier transistors, and each of which is connected to a common power supply terminal which is further connected to a collector of the high-frequency power amplifier transistor at a first stage among said high-frequency power amplifier transistors, and

a passive element connected between the common supply terminal and a collector of the corresponding one of said bias supply transistors connected to the high-frequency power amplifier transistor at the first stage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2009
From: ISHIHARA, SHINICHIRO; IWATA, MOTOYOSHI; ENOMOTO, SHINGO
To: PANASONIC CORPORATION
Reel/Frame 022716/0341 →
Priority Claims (1)
JP 2008-102889 · Apr 10, 2008 · national
Continuity (1)
Related Publication 20090256637A1 · Oct 15, 2009