IP Library Granted Patent US 7,875,482
Granted Patent B2
US 7,875,482 · App. 12/407,639 · Granted Jan 25, 2011

Substrate with multiple encapsulated pressures

Assignee: Robert Bosch GmbH
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Quick Facts
Patent No.
US 7,875,482
App. No.
12/407,639
Granted
Jan 25, 2011
Kind
B2
Abstract

A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.

Claims (54)

1. A method of forming a device with multiple encapsulated pressures, comprising:

providing a substrate;

forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location;

encapsulating the functional layer;

forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location;

modifying an environment adjacent the at least one diffusion resistant layer; and

diffusing a gas into the second location as a result of the modified environment.

2. The method of claim 1 , further comprising:

diffusing a gas into the first location as a result of the modified environment through the at least one diffusion resistant layer and the epitaxial cap layer.

3. The method of claim 2 , wherein the diffusing of a gas into the first location comprises:

diffusing the gas into the first location through trenches in the epitaxial cap layer.

4. The method of claim 1 , further comprising:

forming the functional layer including a third device portion at a third location;

forming the at least one diffusion resistant layer with a first diffusion resistant layer at a location above the first location and the third location and not above the second location, and with a second diffusion resistant layer at a location above the first location and not above the third location or the second location; and

diffusing the gas into the third location as a result of the modified environment.

5. The method of claim 1 , wherein the first device portion comprises an accelerometer portion and the second device portion comprises a gyroscope portion.

6. The method of claim 1 , wherein modifying the environment comprises:

increasing the concentration of hydrogen within the environment; and

increasing the temperature of the environment.

7. The method of claim 1 , wherein:

forming a functional layer includes

forming a first chamber at the first location, and

forming a second chamber at the second location; and

encapsulating the functional layer includes

sealing the first chamber with a first pressure therein, and

sealing the second chamber with a second pressure therein, the second pressure substantially equal to the first pressure.

8. A method of forming a device with multiple encapsulated pressures, comprising:

providing a substrate;

forming a functional layer on top of a surface of the substrate;

forming at least one first chamber in the functional layer;

forming a second chamber in the functional layer;

sealing the at least one first chamber;

sealing the second chamber;

forming a first diffusion resistant layer above the sealed second chamber but not above the sealed at least one first chamber; and

diffusing gas into the sealed at least one first chamber.

9. The method of claim 8 , wherein diffusing gas comprises:

controlling the temperature of the device; and

increasing the hydrogen concentration of an environment about the device.

10. The method of claim 8 , wherein sealing the first chamber and sealing the second chamber comprises:

forming an oxide layer on an encapsulating layer.

11. The method of claim 10 , further comprising, prior to formation of the at least one first chamber:

forming a first portion of the encapsulating layer; and

forming vent holes through the first portion.

12. The method of claim 8 , further comprising:

forming a third chamber in the functional layer;

sealing the third chamber;

forming the first diffusion resistant layer above the sealed third chamber; and

forming a second diffusion resistant layer above the sealed third chamber but not above the sealed second chamber or the sealed at least one first chamber.

13. The method of claim 12 , wherein:

the second chamber is associated with a functional component of a first type; and

the third chamber is associated with a functional component of the first type.

14. The method of claim 8 , wherein the at least one chamber comprises:

a plurality of first chambers.

15. The method of claim 14 , wherein each of the plurality of first chambers is associated with a respective one of a plurality of functional components, each of the plurality of functional components having a function different from each of the other of the plurality of functional components.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2009
From: CANDLER, ROBERT N; YAMA, GARY
To: ROBERT BOSCH GMBH
Reel/Frame 022423/0186 →
Continuity (1)
Related Publication 20100240163A1 · Sep 23, 2010