Image sensor and method for manufacturing an image sensor
Provided are methods for manufacturing an image sensor. A method for manufacturing an image sensor can include: forming a readout circuitry on a substrate; forming an electrical junction region in the substrate; forming an interconnection connected to the electrical junction region; and forming an image sensing device on the interconnection. The readout circuitry can be formed on a first substrate. The electrical junction region can be formed in the first substrate to electrically connect the image sensing device with the readout circuitry. The image sensing device can be formed using a second substrate that is then bonded on the interconnection.
1. An image sensor comprising:
a readout circuitry comprising a first transistor and a second transistor on a first substrate, wherein the first transistor comprises a first transfer transistor and the second transistor comprises a second transfer transistor;
an electrical junction region between the first transfer transistor and the second transfer transistor in the first substrate, the electrical junction region being electrically connected with the readout circuitry;
an interconnection for connection to the electrical junction region; and
an image sensing device on the interconnection,
wherein each pixel comprises the first transfer transistor and the second transfer transistor.
2. The image sensor according to claim 1 , further comprising a first conduction type second connection region at one side of the second transfer transistor, the first conduction type second connection region being connected with the interconnection, wherein a signal from the interconnection passes from the first conduction type second connection region to the electrical junction region when the second transfer transistor is turned on.
3. The image sensor according to claim 1 , wherein the electrical junction region comprises:
a first conduction type ion implantation region in the first substrate; and
a second conduction type ion implantation region on the first conduction type ion implantation region.
4. The image sensor according to claim 1 , wherein the electrical junction region provides a potential difference between a source and a drain of the first transfer transistor of the readout circuitry.
5. The image sensor according to claim 4 , wherein an ion implantation concentration of the electrical junction region at the source of the first transfer transistor is lower than an ion implantation concentration of a floating diffusion region at the drain of the first transfer transistor.
6. The image sensor according to claim 1 , wherein the electrical junction region comprises a PN junction.
7. The image sensor according to claim 1 , wherein the electrical junction region comprises a PNP junction.
8. The image sensor according to claim 1 , further comprising a first conduction type connection region between the electrical junction region and the interconnection.
9. The image sensor according to claim 8 , wherein the first conduction type connection region is formed at a side of the second transfer transistor.
10. The image sensor according to claim 1 , wherein the image sensing device comprises:
a first conduction type conduction layer; and
a second conduction type conduction layer on the first conduction type conduction layer.
11. A method for manufacturing an image sensor, comprising:
forming a readout circuitry comprising a first transistor and a second transistor on a first substrate, wherein the first transistor comprises a first transfer transistor and the second transistor comprises a second transfer transistor;
forming an electrical junction region between the first transfer transistor and the second transfer transistor in the first substrate, the electrical junction region being electrically connected with the readout circuitry;
forming an interconnection for connection to the electrical junction region; and
forming an image sensing device on the interconnection,
wherein each pixel comprises the first transfer transistor and the second transfer transistor.
12. The method to claim 11 , further comprising forming a first conduction type second connection region at one side of the second transfer transistor, the first conduction type second connection region being connected with the interconnection, wherein a signal from the interconnection passes from the first conduction type second connection region to the electrical junction region when the second transfer transistor is turned on.
13. The method to claim 11 , wherein forming the electrical junction region comprises:
forming a first conduction type ion implantation region in the first substrate; and
forming a second conduction type ion implantation region on the first conduction type ion implantation region.
14. The method according to claim 11 , wherein the electrical junction region is formed such that there is a potential difference between a source and a drain of the first transfer transistor of the readout circuitry.
15. The method according to claim 14 , wherein an ion implantation concentration of the electrical junction region at the source of the first transfer transistor is lower than an ion implantation concentration of a floating diffusion region at the drain of the first transfer transistor.
16. The method according to claim 11 , wherein the electrical junction region comprises a PN junction.
17. The method according to claim 11 , further comprising forming a first conduction type connection region between the electrical junction region and the interconnection.
18. The method according to claim 17 , wherein the first conduction type connection region is formed at a side of the second transfer transistor.
19. The method according to claim 11 , wherein forming the image sensing device comprises:
forming a first conduction type conduction layer; and
forming a second conduction type conduction layer on the first conduction type conduction layer.
20. The method according to claim 11 , wherein forming the image sensing device comprises bonding a second substrate comprising the image sensing device to the first substrate.