Bipolar power semiconductor component comprising a p-type emitter and more highly doped zones in the p-type emitter, and production method

1. A bipolar semiconductor component comprising a semiconductor body, the semiconductor body including a p-doped emitter, an n-doped base, a p-doped base and an n-doped main emitter arranged successively in a vertical direction, the p-doped emitter having a number of p-doped zones, the p-doped zones having a locally increased p-type doping, and

configured as a thyristor, and further comprising a triggering stage structure having at least on triggering stage, and wherein the p-doped zones are disposed exclusively outside a lateral extent of the triggering stage structure.

2. The semiconductor component as claimed in claim 1 , wherein the p-doped zones are spaced apart from the n-doped base.

3. The semiconductor component as claimed in claim 1 , wherein the p-doped zones abut the n-type base.

4. The semiconductor component as claimed in claim 1 , wherein the p-doped zones extend to a surface of the semiconductor component.

5. The semiconductor component as claimed in claim 1 , wherein the p-doped zones are completely surrounded by the p-doped emitter.

6. The semiconductor component as claimed in claim 1 , wherein all of the p-doped zones are spaced apart from the lateral edge of the semiconductor body.

7. The semiconductor component as claimed in claim 1 , configured as an IGBT, and further comprising a gate electrode arranged adjacent to the p-type base.

8. The semiconductor component as claimed in claim 1 , wherein the p-doped emitter includes a first zone having a locally reduced charge carrier lifetime.

9. The semiconductor component as claimed in claim 8 , wherein the first zone is spaced apart from a surface of the semiconductor body nearest the p-type emitter.

10. The semiconductor component as claimed in claim 8 , wherein:

the n-doped main emitter is disposed adjacent to a first surface of the semiconductor body;

a top surface of at least one of the p-doped zones closest to the first surface is spaced apart from the first surface by a first distance; and

the first zone is separate from the first surface by a distance greater than the first distance.

11. The semiconductor component as claimed in claim 8 , wherein the first zone includes at least portions of at least one p-doped zone, and at least portions of an area of the p-doped emitter outside of the p-doped zones.

12. The semiconductor component as claimed in claim 8 , wherein a lateral dimension of at least one p-doped zone is between 10% and 100% of a lateral distance between adjacent p-doped zones.

13. The semiconductor component as claimed in claim 8 , wherein a vertical dimension of at least on p-doped zone is between 10% and 100% of a vertical dimension of the p-doped emitter.

14. The semiconductor component as claimed in claim 8 , wherein a dopant dose determined in a vertical direction in the p-type emitter is greater at least by a factor of 10 in a region in which a p-type zone is located than in a region without a p-type zone.

15. A bipolar semiconductor component comprising

a semiconductor body portion, the semiconductor body portion including a p-doped emitter, an n-doped base, a p-doped base and an n-doped emitter arranged successively in a vertical direction, the p-doped emitter having a number of p-doped zones, the p-doped zones having an increased p-type doping compared to adjacent portions of the p-doped emitter;

a first electrode proximate to the p-doped emitter;

a second electrode proximate to the n-doped emitter, and

configured as a thyristor, and further comprising a triggering stage structure having at least on triggering stage, and wherein the p-doped zones are disposed exclusively outside a lateral extent of the triggering stage structure.