Method for manufacturing integrated circuit device having antenna conductors
A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.
1. A method for manufacturing an integrated circuit device having antenna conductors, the method comprising the steps of:
providing a wafer with a plurality of integrated circuit components, wherein each integrated circuit component on its surface includes a dielectric layer and an electrode embedded in the dielectric layer;
forming an antenna conductor having a first end and a second end on the surface;
forming a plurality of metal bumps respectively positioned on the first end and the second end by screen-printing;
coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; and
removing a portion of the insulating layer to expose a top portion of each metal bump.
2. The method according to claim 1 , wherein the first end is connected to the electrode, and the antenna conductor is formed as a loop around the second end.
3. The method according to claim 1 , further comprising cutting the wafer to form a plurality of integrated circuit chips, wherein each integrated circuit chip is packaged and is separated from each other.
4. The method according to claim 2 , wherein the first end of the antenna conductor is formed with a bottom surface larger an upper surface of the electrode.