IP Library › Granted Patent US 7,898,050
Granted Patent B2
US 7,898,050 · App. 12/131,185 · Granted Mar 1, 2011

Image sensor and method for manufacturing the sensor

Assignee: Dongbu HiTek Co., Ltd.
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Quick Facts
Patent No.
US 7,898,050
App. No.
12/131,185
Granted
Mar 1, 2011
Kind
B2
Abstract

An image sensor and a method for manufacturing the sensor are provided for reducing loss of light reflected from photodiodes, and thus, improving light efficiency. The method of manufacturing an image sensor can include providing a semiconductor substrate having a photodiode; and then forming a reflective film frame on the photodiode, the reflective film frame having sidewalls that are inclined with respect to the uppermost surface of the photodiode; and then forming an opening over the surface of the reflective film frame and corresponding to the photodiode by forming a reflective film on the sidewalls of the reflective film frame.

Claims (15)

1. An image sensor comprising:

a plurality of photodiodes formed on a semiconductor substrate;

a reflective film frame formed directly on each of the photodiodes, the reflective film frame having sidewalls that are inclined with respect to the uppermost surface of the photodiodes; and

a reflective film formed directly on the sidewalls of the reflective film frame, the reflective film forming an opening over a respective one of the photodiodes for receiving light, wherein a bottom surface of the reflective film returns light reflected by the respective one of the photodiodes to the respective one of the photodiodes.

2. The image sensor of claim 1 , further comprising:

an interlayer insulating film formed on the semiconductor substrate including the reflective film;

a protective film formed on the interlayer insulating film;

a plurality of color filter layers formed on the protective film at specific intervals;

a planarization layer formed on the semiconductor substrate including the color filter layers; and

a micro lens formed on the planarization layer corresponding to a respective one of the photodiodes.

3. The image sensor of claim 1 , wherein the reflective films are composed of a metal material.

4. The image sensor of claim 1 , wherein the opening occupies between 70 to 90% of an uppermost surface area of a respective one of the photodiodes.

5. The image sensor of claim 1 , wherein the reflective film frame is composed of an oxide material.

6. The image sensor of claim 2 , wherein the interlayer insulating film comprises a plurality of insulating layers.

7. The image sensor of claim 2 , wherein the color filter layers comprise red, green and blue color filter layers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2008
From: KIM, DAE-YOUNG
To: DONGBU HITEK CO., LTD.
Reel/Frame 021025/0647 →
Priority Claims (1)
KR 10-2007-0136247 · Dec 24, 2007 · national
Continuity (1)
Related Publication 20090160000A1 · Jun 25, 2009