Laser machining apparatus and laser machining method
Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.
1. A laser machining apparatus comprising:
a workpiece fixture for fastening a workpiece,
a first laser removing device having a first laser source, a first laser beam and a first laser beam outlet for laser drilling a workpiece using first operating parameters, and
a second laser removing device having a second laser source, a second laser beam and a second laser beam outlet for machining a workpiece using second operating parameters that are different from said first operating parameters,
wherein:
the second laser removing device is configured to remove material of the workpiece in layers,
the first and second laser beam outlets of the first and second laser removing devices are fixedly mounted offset from each other with respect to at least one axis,
the first laser removing device comprises one or more of the following operating parameters:
a pulsed laser light having a laser pulse frequency of 0.1 to 100 Hz;
a laser pulse duration of 0.1 to 20 ms;
a pulse peak performance >1 kW;
a laser performance of 300 W to 3 kW;
an energy per pulse of 1-100 J; and
a laser type comprising one of a diode-pumped solid-state laser or a lamp-pumped solid-state laser;
the second laser removing device comprises one or more of the following operating parameters:
a pulsed laser light having a laser pulse frequency of 1 to 100 kHz;
a laser pulse duration of 10 to 1500 ns;
a laser performance of 10 to 200 W;
an energy per pulse of 1-50 mJ; and
a laser type comprising a quality-switched solid-state laser; and
the workpiece fixture is configured to move the workpiece between operating windows of the first and the second laser removal devices.
2. The laser machining apparatus according to claim 1 ,
wherein at least one of said laser removing devices comprises a beam guide.
3. The laser machining apparatus according to claim 1 , wherein at least one of the first and second laser beam outlets is movable with respect to at least one axis.
4. The laser machining apparatus according to claim 3 , wherein said first laser removing device comprises a first laser source and said second laser removing device comprises a second laser source, and further wherein at least one of the first and second laser sources is movable in parallel and in sync with the at least one of the first and second laser beam outlets.
5. The laser machining apparatus according to claim 1 , further comprising a first control for controlling the first laser removing device and a second control for controlling the second laser removing device.
6. The laser machining apparatus according to claim 5 , wherein the second control operates at a higher clock frequency than the first control.
7. The laser machining apparatus according to claims 5 or 6 , further comprising an interface communicating between the first and second controls.
8. The laser machining apparatus according to claim 1 , wherein the first laser removing device comprises a first optical system and the second laser removing device comprises a second optical system.
9. The laser machining apparatus according to claim 1 , wherein the first laser removing device comprises a first sensor system and the second laser removing device comprises a second sensor system.
10. The laser machining apparatus according to claim 1 , wherein the first and second laser beam outlets of the first and second laser removing devices are fixedly mounted offset from each other with respect to two axes.
11. The laser machining apparatus according to claim 1 , wherein the first laser moving device comprises a pulsed laser light having a laser pulse frequency of 1 to 30 Hz.
12. The laser machining apparatus according to claim 1 , wherein the first laser moving device has a laser pulse duration of 0.3 to 2 ms.
13. The laser machining apparatus according to claim 1 , wherein the first laser moving device has a pulse peak performance greater than 20 kW.
14. The laser machining apparatus according to claim 1 , wherein the first laser moving device has an energy per pulse of 10 to 50 J.
15. The laser machining apparatus according to claim 1 , wherein the second laser moving device comprises a pulsed laser light having a laser pulse frequency of 10 to 50 kHz.
16. The laser machining apparatus according to claim 1 , wherein the second laser moving device has a laser pulse duration of 100 to 500 ns.
17. The laser machining apparatus according to claim 1 , wherein the second laser moving device has a laser performance of 20 to 50 W.
18. A laser machining method wherein a workpiece is clamped and then machined using laser light, wherein a first machining step of laser drilling the workpiece is performed through a first laser removing device having a first laser beam and a first laser outlet and using first operating parameters and a second machining step is performed through a second laser removing device having a second laser beam and a second laser outlet to machine the workpiece using second operating parameters different from the first operating parameters,
wherein:
the second machining step comprises removing material of the workpiece in layers using the second laser beam,
the first and second laser beams of the first and second laser removal devices are radiated at the first and second laser beam outlets which are fixedly mounted offset from each other with respect to at least one axis, and
the workpiece is moved without changing the clamping between operating windows of the first and the second laser removal devices.
19. The method according to claim 18 , wherein a measurement of the distance necessary for the second machining step is performed before the first machining step is taken.
20. The method according to claims 18 or 19 , wherein during the first machining step using the first laser removing device a focusing of the first laser beam is fixed whereas during the second machining step using the second laser removing device a focusing of the second laser beam is tracked.
21. The method according to claims 18 or 19 , wherein during the first machining step using the first laser removing device process gas is supplied.
22. The method according to claim 20 , wherein during the first machining step using the first laser removing device process gas is supplied.
23. The method according to claim 18 , wherein during the second machining step using the second laser removing device the location of the second laser beam is guided by a variable beam guide.
24. The method according to claim 18 , wherein during the first machining step using the first laser removing device the relative position of the location of the first laser removing device to the workpiece is changed.
25. The method according to claim 18 , wherein first the machining step having a higher laser performance is taken and then the machining step having a lower laser performance is taken.
26. A method according to claim 18 , wherein the first and second laser beams of the first and second laser removal devices are radiated at the first and second laser beam outlets which are fixedly mounted offset from each other with respect to two axes.