IP Library Granted Patent US 7,905,404
Granted Patent B2
US 7,905,404 · App. 12/067,776 · Granted Mar 15, 2011

Smartcard and method of producing smartcards

Assignee: Setec Oy
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Quick Facts
Patent No.
US 7,905,404
App. No.
12/067,776
Granted
Mar 15, 2011
Kind
B2
Abstract

The invention relates to a smartcard ( 1 ) comprising: a first section ( 4 ) enclosing a contactless microcircuit ( 2 ). In order to improve the security of the smart card against forgery said smartcard comprises: a compensation section ( 7 ) of a transparent material, said compensation section having substantially the same thickness as the first section ( 4 ) and surrounding said first section, a top section ( 5 ) of a transparent material, said top section being arranged on top of said first section ( 4 ) and said compensation section ( 7 ) as a surface layer of said smartcard ( 1 ), and a bottom section ( 6 ) of a transparent material, said bottom section being arranged under said first section ( 4 ) and said compensation section ( 7 ) as a surface layer of said smartcard ( 1 ).

Claims (25)

1. A smartcard comprising:

a first section enclosing a contactless microcircuit,

a compensation section of a transparent material, said compensation section having substantially the same thickness as the first section and surrounding said first section,

a top section of a transparent material, said top section being arranged on top of said first section and said compensation section as a surface layer of said smartcard, and

a bottom section of a transparent material, said bottom section being arranged under said first section and said compensation section as a surface layer of said smartcard, and wherein

said transparent top section and transparent bottom section are attached to the transparent compensation section in order to obtain transparent edges for the smartcard.

2. A smartcard according to claim 1 , wherein said smartcard is at least partly manufactured of a material suitable for laser engraving.

3. A smartcard according to claim 1 , wherein said microcircuit includes an antenna coiled into the material of said first section.

4. A smartcard according to claim 1 , wherein the material of said first section is non-transparent.

5. A smartcard according to claim 1 , wherein a non-transparent pattern covering said microcircuit is arranged to said first section or said top section.

6. A smartcard according to claim 1 , wherein said transparent material is a material which is transparent in the range of visible light, ultra violet light or infrared light.

7. A method of manufacturing smartcards, said method comprises:

enclosing a plurality of contactless microcircuits separately into a material in order to produce a plurality of first sections each containing a contactless microcircuit,

producing a compensation layer of a transparent material to include a plurality of holes that each have a size selected for receiving one of said first sections,

arranging said compensation layer onto a surface section of a transparent material,

arranging said first sections containing said microcircuits into said holes of said compensation layer,

arranging a second surface section of a transparent material onto said compensation layer,

attaching said sections to each other by laminating, and

separating the produced smartcards from each other by cutting in order to obtain smartcards where said transparent first surface section, and said transparent second surface section are attached to said transparent compensation layer to provide transparent edges for the smartcards, such that each produced smartcard is entirely covered by transparent material.

8. A method according to claim 7 , wherein said first section and at least one of said surface sections are at least partly produced of a material suitable for laser engraving.

9. A method according to claim 7 , wherein said first section or at least one of said surface sections are at least partly produced of a material suitable for laser engraving.

10. A method according to claim 7 , wherein at least one of:

said first section, said compensation layer or said surface sections consists of a plurality of layers.

11. A method according to claim 7 , wherein said method comprises encapsulating said microcircuit into a protective material from which protrudes a coiled antenna of said microcircuit, prior to enclosing said microcircuit into said material of the first section.

12. A method according to claim 7 , wherein said transparent material is a material which is transparent in the range of visible light, ultra violet light or infrared light.

Assignments (3)
CHANGE OF NAME Recorded Sep 14, 2023
From: SETEC OY
To: GEMALTO OY
Reel/Frame 064899/0096 →
CHANGE OF NAME Recorded Sep 14, 2023
From: GEMALTO OY
To: THALES DIS FINLAND OY
Reel/Frame 064899/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2008
From: KORHONEN, MAILA; HOLMBERG, MIKA; HERLIN, JARI
To: SETEC OY
Reel/Frame 021338/0809 →
Priority Claims (1)
EP 05108761 · Sep 22, 2005 · regional
Continuity (1)
Related Publication 20090065589A1 · Mar 12, 2009