Device having zinc oxide semiconductor and indium/zinc electrode
An electronic device including: (a) a semiconductor layer including crystalline zinc oxide; and (b) an electrode including a suitable amount of zinc, indium, or a mixture thereof.
1. A process comprising:
fabricating a thin film transistor comprising in any effective arrangement a semiconductor layer, a gate dielectric, a gate electrode, a source electrode, and a drain electrode,
wherein at least one of the source electrode and the drain electrode comprises a suitable amount of zinc, indium, or a mixture thereof, wherein the semiconductor layer is formed by a semiconductor fabrication process comprising: liquid depositing one or more zinc oxide-precursor compositions and forming the semiconductor layer comprising polycrystalline zinc oxide from the liquid deposited one or more zinc oxide-precursor compositions; and
wherein the semiconductor layer fabrication process further comprises heating the deposited composition and cooling the heated deposited composition; and wherein the zinc oxide precursor composition comprises a zinc compound, a solvent, and a complexing agent selected from the group consisting of a carboxylic acid and an organoamine.
2. The process of claim 1 , wherein the polycrystalline zinc oxide is preferentially oriented with the c-axis perpendicular to the plane of the semiconductor layer.
3. The process of claim 1 , wherein the source electrode and the drain electrode are a single layer.
4. The process of claim 1 , wherein at least one of the source electrode and the drain electrode has a surface area contacting the semiconductor layer that comprises the zinc, the indium, or the mixture thereof in about 10% to 100% of the electrode contact surface area.
5. The process of claim 1 , wherein the at least one of the source electrode and the drain electrode comprises indium.
6. The process of claim 1 , wherein at least one of the source electrode and the drain electrode is fabricated by a method comprising vacuum evaporation, chemical vapor deposition, or plasma sputtering, or liquid deposition of a dispersion.
7. The process of claim 1 , wherein the thin film transistor has a field-effect mobility of greater than about 0.3 cm 2 V −1 s −1 .
8. The process of claim 1 , wherein the thin film transistor has a field-effect mobility of greater than about 5 cm 2 V −1 s −1 .
9. The process of claim 1 , wherein the thin film transistor has a field-effect mobility of greater than about 10 cm 2 V −1 s −1 .