IP Library › Granted Patent US 7,910,856
Granted Patent B2
US 7,910,856 · App. 11/988,915 · Granted Mar 22, 2011

Hybrid laser processing apparatus

Assignee: Shibuya Kogyo Co., Ltd.
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Quick Facts
Patent No.
US 7,910,856
App. No.
11/988,915
Granted
Mar 22, 2011
Kind
B2
Abstract

A processing table 3 holding a workpiece 2 is accommodated in a chamber 4 with a gas-tight condition kept, and a liquid column W is jetted to an upper surface of this chamber 4 , and a processing head 9 that guides laser beam L to the liquid column W is secured to the upper surface of this chamber 4. An oil-sealed rotary pump 11 and a diffusion pump 12 provided in parallel are connected to the chamber 4 , and the diffusion pump 12 is actuated after the actuation of the oil-sealed rotary pump 11 , bringing the inside of the chamber 4 into a vacuum state. No gas currents are generated around the liquid column W jetted from the processing head 9 , making it possible to prevent turbulence of the liquid column W due to turbulence of the gas currents and enabling a liquid column having a small diameter to be jetted in a stable state.

Claims (2)

1. A hybrid laser processing apparatus including a processing head having a jet hole; liquid supply means for supplying the processing head with a high-pressure liquid; a laser oscillator for oscillating a laser beam; a condensing lens for condensing the oscillated laser beam; a chamber for enclosing at least a space formed between the processing head and a workpiece; and gas exhaust means for bringing the interior of the chamber into a vacuum state, wherein the apparatus performs processing on the workpiece by jetting a liquid supplied from the liquid supply means from the jet hole in the form of a liquid column and guiding the laser beam to the liquid column by the condensing lens, the jet hole comprises a first angled surface which is formed on a side on the condensing lens and converges toward the workpiece, a second angled surface which diverges toward the workpiece and the jet hole has a minimum diameter portion having a diameter of no more than 50 μm and the processing head is fixed to the upper surface of the chamber.

2. The hybrid laser processing apparatus according to claim 1 , characterized by comprising drainage means including a catcher, provided below the workpiece, that receives a liquid that has penetrated the workpiece; and a drainage pump that aspirates the liquid in the catcher and drains it to the outside of the chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2010
From: KOSEKI, RYOJI; SASAKI, MOTOI
To: SHIBUYA KOGYO CO., LTD.
Reel/Frame 023910/0390 →
Priority Claims (1)
JP 2005-243726 · Aug 25, 2005 · national
Continuity (1)
Related Publication 20100108648A1 · May 6, 2010