IP Library › Granted Patent US 7,910,957
Granted Patent B2
US 7,910,957 · App. 12/342,453 · Granted Mar 22, 2011

Semiconductor device

Assignee: Fujitsu Semiconductor Limited
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Quick Facts
Patent No.
US 7,910,957
App. No.
12/342,453
Granted
Mar 22, 2011
Kind
B2
Abstract

A semiconductor device has a first and a second active regions of a first conductivity type disposed on a semiconductor substrate, a third and a fourth active regions of a second conductivity type disposed on the semiconductor substrate, the second and the fourth active regions having sizes larger than those of the first and the third active regions respectively, a first electroconductive pattern disposed adjacent to the first active region and having a first width, a second electroconductive pattern disposed adjacent to the second active region and having a second width larger than the first width, a third electroconductive pattern disposed adjacent to the third active region and having a third width; and a fourth electroconductive pattern disposed adjacent to the fourth active region and having a fourth width smaller than the third width.

Claims (29)

1. A semiconductor device comprising:

a first and a second active regions of a first conductivity type disposed on a semiconductor substrate;

a third and a fourth active regions of a second conductivity type disposed on the semiconductor substrate, the second and the fourth active regions having sizes larger than those of the first and the third active regions respectively;

a first electroconductive pattern disposed over the first active region and having a first width;

a second electroconductive pattern disposed over the second active region and having a second width larger than the first width;

a third electroconductive pattern disposed over the third active region and having a third width; and

a fourth electroconductive pattern disposed over the fourth active region and having a fourth width smaller than the third width, wherein

the first electroconductive pattern is electrically connected to the third electroconductive pattern,

the second electroconductive pattern is electrically connected to the fourth electroconductive pattern, and

the second width is the same as the fourth width.

2. The semiconductor device according to claim 1 , wherein a distance between one end of the first active region and one sidewall of the first electroconductive pattern is smaller than a distance between one end of the second active region and one sidewall of the second electroconductive pattern, and a distance between one end of the third active region and one sidewall of the third electroconductive pattern is smaller than a distance between one end of the fourth active region and one sidewall of the fourth electroconductive pattern.

3. The semiconductor device according to claim 1 , wherein the third width is larger than the first width.

4. The semiconductor device according to claim 1 , wherein the first active region, the second active region, the third active region, and the fourth active region are individually surrounded by a device isolation region on the semiconductor substrate.

5. The semiconductor device according to claim 4 , wherein a trench is in the device isolation region and an insulating layer is embedded in the trench.

6. The semiconductor device according to claim 5 , wherein the top surfaces of the first active region, the second active region, the third active region, and the fourth active region are higher than the top surface of the insulating layer.

7. The semiconductor device according to claim 1 , wherein the first electroconductive pattern is a first gate electrode of a first transistor of a first conductivity type, the second electroconductive pattern is a second gate electrode of a second transistor of the first conductivity type, the third electroconductive pattern is a third gate electrode of a third transistor of a second conductivity type, and the fourth electroconductive pattern is a fourth gate electrode of a fourth transistor of the second conductivity type.

8. The semiconductor device according to claim 7 , wherein a first source/drain region of the first transistor formed in the first active region has a same impurity depth profile as a second source/drain region of the second transistor formed in the second active region, and a third source/drain region of the third transistor formed in the third active region has a same impurity depth profile as a fourth source/drain region of the fourth transistor formed in the fourth active region.

9. A semiconductor device comprising:

a first and a second active regions of a first conductivity type disposed on a semiconductor substrate;

a third and a fourth active regions of a second conductivity type disposed on the semiconductor substrate, the second and the fourth active regions having sizes larger than those of the first and the third active regions respectively;

a first electroconductive pattern disposed over the first active region and having a first width;

a second electroconductive pattern disposed over the second active region and having a second width larger than the first width;

a third electroconductive pattern disposed over the third active region and having a third width; and

a fourth electroconductive pattern disposed over the fourth active region and having a fourth width smaller than the third width, wherein

the first electroconductive pattern is a first gate electrode of a first transistor of a first conductivity type,

the second electroconductive pattern is a second gate electrode of a second transistor of the first conductivity type,

the third electroconductive pattern is a third gate electrode of a third transistor of a second conductivity type,

the fourth electroconductive pattern is a fourth gate electrode of a fourth transistor of the second conductivity type, and

gate insulating layers formed between the semiconductor substrate and the first gate electrode, the second gate electrode, the third gate electrode, and fourth gate electrode have the same thickness.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
MERGER Recorded May 24, 2023
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU LIMITED
Reel/Frame 064221/0545 →
CHANGE OF NAME AND CHANGE OF ADDRESS Recorded Jul 16, 2020
From: AIZU FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053481/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2020
From: FUJITSU SEMICONDUCTOR LIMITED
To: AIZU FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053209/0468 →
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
CHANGE OF NAME Recorded Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2009
From: MITANI, JUNICHI; NAKAI, SATOSHI; FUJITA, KAZUSHI
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022061/0893 →
Priority Claims (1)
JP 2007-340631 · Dec 28, 2007 · national
Continuity (1)
Related Publication 20090166746A1 · Jul 2, 2009