Dynamic burn-in systems and apparatuses
A burn-in apparatus with a radio frequency signal generator is provided. One embodiment includes a printed circuit board to carry a plurality of semiconductor devices for a burn-in process and a radio frequency signal generator mounted on the printed circuit board to provide a plurality of radio frequency signals to the plurality of semiconductor devices respectively during the burn-in process of the plurality of semiconductor devices.
1. An apparatus, comprising:
a burn-in board to carry a plurality of semiconductor devices inside a burn-in oven and to receive a digital signal via a wired connection from a burn-in driver located outside the burn-in oven, the burn-in board comprising a printed circuit to distribute the digital signal to a digital processing part of each of the plurality of semiconductor devices; and
a radio frequency signal generator mounted on the burn-in board to provide a plurality of analog radio frequency signals, the printed circuit to connect each of the analog radio frequency signals to a receiver part of a corresponding one of the plurality of semiconductor devices separately from distributing the digital signal to the digital processing part of each of the plurality of semiconductor devices.
2. The apparatus of claim 1 , wherein the apparatus further comprises an digital to analog converter to receive a second digital signal from the burn-in drive and to generate a control signal to frequency modulate an analog signal; and the radio frequency signal generator comprises a Wilkinson power divider to divide the analog signal to generate the plurality of analog radio frequency signals.
3. The apparatus of claim 2 , wherein the radio frequency signal generator further comprises a voltage controlled oscillator.
4. The apparatus of claim 3 , wherein the voltage controlled oscillator is controllable according to an input signal to adjust frequency of an output of the radio frequency signal generator.
5. The apparatus of claim 3 , wherein the Wilkinson power divider splits a radio frequency signal generated by the voltage controlled oscillator into the plurality of radio frequency signals.
6. The apparatus of claim 5 , wherein the radio frequency signal generator further comprises an attenuation network; the attenuation network attenuates a radio frequency signal received from the voltage controlled oscillator to provide an attenuated radio frequency signal to the Wilkinson power divider.
7. The apparatus of claim 5 , wherein the plurality of radio frequency signals have equal power.
8. The apparatus of claim 2 , further comprising a port to receive a radio frequency signal wherein the Wilkinson power divider splits the radio frequency signal received from the port into the plurality of radio frequency signals.
9. The apparatus of claim 2 , wherein the radio frequency signal generator further comprises an attenuation network; the attenuation network provides an attenuated radio frequency signal to the Wilkinson power divider.
10. The apparatus of claim 9 , wherein the attenuation network is controllable according to an input signal to adjust amplitude of the attenuated radio frequency signal.
11. The apparatus of claim 1 , wherein the plurality of semiconductor devices comprise a plurality of integrated circuits; and the burn-in board comprise a plurality of sockets to removably receive the plurality of integrated circuits.
12. An apparatus, comprising:
a burn-in board comprising a printed circuit to carry a plurality of semiconductor devices inside a burn-in oven and to receive a digital signal via a wired connection from a burn-in driver located outside the burn-in oven, the printed circuit to distribute the digital signal to a digital processing part of each of the plurality of semiconductor devices; and
a power divider mounted on the burn-in board to split an analog signal into a plurality of analog input signals, the printed circuit to connect each of the plurality of analog input signals to a receiver part of a corresponding one of the plurality of semiconductor devices separately from distributing the digital signal to the digital processing part of each of the plurality of semiconductor devices.
13. The apparatus of claim 12 , wherein the apparatus further comprises an digital to analog converter to receive a second digital signal from the burn-in drive and to generate a control signal to frequency modulate the analog signal.
14. The apparatus of claim 12 , wherein power divider is an equal Wilkinson power divider.
15. The apparatus of claim 12 , further comprising a voltage controlled oscillator (VCO) based signal generator mounted on the printed circuit board to generate the analog signal.
16. The apparatus of claim 15 , wherein at least one of frequency and amplitude of the analog signal is controllable via one or more digital signals.
17. An apparatus, comprising:
a burn-in oven;
a burn-in driver disposed outside the burn-in oven to provide a first digital signal;
a burn-in board disposed inside the burn-in oven and coupled to the burn-in driver to receive the first digital signal via a wired connection, the burn-in board comprising a printed circuit to carry a plurality of semiconductor Devices Under Test (DUTs) and to distribute the first digital signal to a digital processing part of each of the DUTs;
a voltage controlled oscillator (VCO) mounted on the printed circuit to provide an analog signal to a receiver part of each of the DUTs; and
an digital to analog converter to receive a second digital signal from the burn-in drive and to generate a control signal to frequency modulate the analog signal generated by the VCO.
18. The apparatus of claim 17 , wherein the analog signal has a frequency above 500 Megahertz.
19. The apparatus of claim 18 , further comprising a Wilkinson power divider to equally divide the analog signal for inputting to the plurality of DUTs.
20. The apparatus of claim 19 , wherein each of the DUTs comprises an integrated circuit (IC).