IP Library Granted Patent US 7,916,514
Granted Patent B2
US 7,916,514 · App. 11/810,228 · Granted Mar 29, 2011

Shunted phase change memory

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,916,514
App. No.
11/810,228
Granted
Mar 29, 2011
Kind
B2
Abstract

By using a resistive film as a shunt, the snapback exhibited when transitioning from the reset state or amorphous phase of a phase change material, may be reduced or avoided. The resistive film may be sufficiently resistive that it heats the phase change material and causes the appropriate phase transitions without requiring a dielectric breakdown of the phase change material.

Claims (14)

1. A phase change memory comprising:

an upper electrode and a lower electrode;

a phase change material that includes at least a portion that transitions between amorphous and crystalline phases, said phase change material extending between said upper and lower electrodes; and

a resistive layer extending along said phase change material from said upper to said lower electrode to shunt the portion of the phase change material.

2. The memory of claim 1 including a pair of electrodes and said phase change material being positioned at least in part between said electrodes.

3. The memory of claim 2 wherein said resistive layer extends from one of said electrodes along said phase change material.

4. The memory of claim 3 wherein said resistive layer extends from one of said electrodes to another of said electrodes.

5. The memory of claim 2 wherein said electrodes are positioned one over another and an insulating film is located between said electrodes.

6. The memory of claim 5 including an opening in one of said electrodes, said phase change material extending into said opening.

7. The memory of claim 6 wherein said electrodes are separated by an insulating layer.

8. The memory of claim 1 wherein said resistive layer reduces snapback when transitioning the phase change material from the amorphous phase to the crystalline phase.

9. The memory of claim 1 wherein said resistive layer has a resistance and wherein the resistance of said resistive layer is higher than a set resistance of the phase change memory material.

10. The memory of claim 1 wherein said resistive layer has a resistance and wherein the resistance of said resistive layer is low enough so that when a voltage across the phase change material approaches a threshold voltage, the resistive layer heats up.

11. The memory of claim 9 wherein the resistive layer has a. resistance lower than a reset resistance of the phase change memory material and higher than the set resistance of the phase change memory material.

Continuity (2)
Division 10318706 · Dec 13, 2002
Related Publication 20070242504A1 · Oct 18, 2007