IP Library › Granted Patent US 7,922,545
Granted Patent B2
US 7,922,545 · App. 11/050,942 · Granted Apr 12, 2011

Press-fit terminal

Assignees: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
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Quick Facts
Patent No.
US 7,922,545
App. No.
11/050,942
Granted
Apr 12, 2011
Kind
B2
Abstract

A press-fit terminal is adapted to be press-fitted in an through-hole of board for electrically conducting with the press-fit terminal. The press-fit terminal includes a terminal-base portion and a board inserting portion at least partially plated with tin. A thickness of the plated tin is from 0.1 to 0.8 μm.

Claims (29)

1. A press-fit terminal adapted to be press-fitted in a through-hole of a board for electrically conducting with the press-fit terminal, comprising:

a terminal-base portion; and

a board inserting portion extending from the terminal-base portion, the board inserting portion at least partially plated with tin, the board inserting portion defining an elliptical-shaped opening, the board inserting portion including a proximal end closest to the terminal-base portion and a distal end farther from the terminal-base portion, wherein

a thickness of the plated tin is from 0.1 to 0.8 μm to inhibit scraping of the tin on the board inserting portion, and

a portion to be plated with the tin is undercoat-plated with nickel to a thickness of from 1 to 1.3 μm, wherein

the elliptical-shaped opening is substantially symmetrical in a top and bottom direction, the elliptical-shaped opening extends completely through the board inserting portion, a width of the opening at the distal and proximal ends is less than a width of the opening between the distal and proximal ends, the width of the elliptical-shaped opening at the distal and proximal ends defining a curved base portion of the elliptical-shaped opening.

2. A press-fit terminal adapted to be press-fitted in a through-hole of a board for electrically conducting with the press-fit terminal, comprising:

a terminal-base portion; and

a board inserting portion extending from the terminal-base portion, the board inserting portion at least partially plated with tin, the board inserting portion defining an elliptical-shaped opening, the board inserting portion including a proximal end closest to the terminal-base portion and a distal end farther from the terminal-base portion, wherein

the thickness of the plated tin is from 0.1 to 0.8 μm to inhibit scraping of the tin on the board inserting portion, the portion to be plated with tin is plated with copper and nickel,

the portion to be plated with the tin is interlayer-plated with the copper,

the portion to be plated with the tin is undercoat-plated with the nickel,

a thickness of the copper-plated interlayer is from 0.5 to 1 μm, and

a thickness of the nickel-plated underlayer is from 1 to 1.3 μm, wherein

the elliptical-shaped opening is substantially symmetrical in a top and bottom direction, the elliptical-shaped opening extends completely through the board inserting portion, a width of the elliptical-shaped opening at the distal and proximal ends is less than a width of the elliptical-shaped opening between the distal and proximal ends, the width of the elliptical-shaped opening at the distal and proximal ends defining a curved base portion of the elliptical-shaped opening.

3. The press-fit terminal according to claim 2 , wherein

a tin-copper diffusion layer is formed between the tin-plated layer and nickel-plated layer by heat treatment.

4. The press-fit terminal according to claim 1 , wherein

a portion to be plated with tin is plated with copper and nickel.

5. The press-fit terminal according to claim 4 , wherein

the portion to be plated with the tin is interlayer-plated with the copper, and

the portion to be plated with the tin is undercoat-plated with the nickel.

6. The press-fit terminal according to claim 5 , wherein

a thickness of the copper-plated interlayer is from 0.5 to 1 μm, and

a thickness of the nickel-plated underlayer is from 1 to 1.3 μm.

7. The press-fit terminal according to claim 1 , wherein the thickness of the plated tin is from 0.3 to 0.5 μm.

8. The press-fit terminal according to claim 1 , wherein the thickness of the plated tin is sufficiently thin to inhibit scraping during insertion into the through-hole that may adversely effect surrounding circuits on the board.

9. The press-fit terminal according to claim 1 , wherein the board inserting portion defining a slit.

10. The press-fit terminal according to claim 1 , wherein the board inserting portion defining a hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2005
From: SAITOH, YASUSHI
To: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 015938/0483 →
Priority Claims (1)
JP P2004-033393 · Feb 10, 2004 · national
Continuity (1)
Related Publication 20050176267A1 · Aug 11, 2005