Millisecond annealing (DSA) edge protection
A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate.
1. A method of thermally processing a substrate in a processing chamber, comprising:
positioning the substrate on a substrate support in the processing chamber;
directing electromagnetic energy toward the substrate; and
positioning an energy blocker to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the positioning an energy blocker comprises using alignment points to align the energy blocker with the substrate support.
2. The method of claim 1 , wherein the energy blocker rests on the substrate support.
3. The method of claim 2 , wherein a portion of the energy blocker is positioned less than about 2 millimeters from the substrate.
4. The method of claim 1 , wherein the energy blocker creates a shadow on the substrate up to about 3 millimeters from the edge of the substrate.
5. A method of thermally processing a substrate in a processing chamber, comprising:
positioning the substrate on a substrate support in the processing chamber;
directing electromagnetic energy toward the substrate;
engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy;
exposing the center of the substrate to electromagnetic radiation; then
disengaging the energy blocker and the substrate support; and then
removing the substrate from the processing chamber.
6. The method of claim 5 , wherein the disengaging the energy blocker and the substrate support comprises actuating a first set of lift pins disposed below the energy blocker, and wherein the removing the substrate comprises:
actuating a second set of lift pins; and
retracting the substrate from the processing chamber with a handling mechanism.
7. The method of claim 6 , wherein the first set of lift pins and the second set of left pins are actuated with a single actuator.
8. A method of thermally processing a substrate in a processing chamber, comprising:
positioning the substrate on a substrate support in the processing chamber;
directing electromagnetic energy toward the substrate;
engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the energy blocker comprises alumina, aluminum nitride, quartz, or silicon carbide.
9. A method of thermally processing a substrate in a processing chamber, comprising:
positioning the substrate on a substrate support in the processing chamber;
directing electromagnetic energy toward the substrate;
engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the engaging an energy blocker and the substrate support further comprises inserting a pin coupled to the substrate support into a recess within the energy blocker to align the energy blocker with the substrate support.